Method of bonding porous metal to metal substrates
First Claim
Patent Images
1. A method for preparing an implant having a porous metal component, comprising:
- a. preparing a loose powder mixture comprising a biocompatible metal powder and a spacing agent;
b. compressing the powder mixture onto a metal base, the metal base comprising a solid metal layer of material taken from a solid metal block;
c. removing the spacing agent to form a compact having a porous metal structure pressed on the metal base;
d. sintering adjacent powder particles of the porous metal structure to one another while concurrently sintering the porous structure to the metal base to form a subassembly;
e. aligning the subassembly with a metal substrate component; and
f. forming a metallurgical bond by diffusion bonding the metal base of the subassembly and the metal substrate component to form an implant.
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Abstract
A method for preparing an implant having a porous metal component. A loose powder mixture including a biocompatible metal powder and a spacing agent is prepared and compressed onto a metal base. After being compressed, the spacing agent is removed, thereby forming a compact including a porous metal structure pressed on the metal base. The compact is sintered, forming a subassembly, which is aligned with a metal substrate portion of an implant. A metallurgical bonding process, such as diffusion bonding, is performed at the interface of the subassembly and the metal substrate to form an implant having a porous metal component.
90 Citations
17 Claims
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1. A method for preparing an implant having a porous metal component, comprising:
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a. preparing a loose powder mixture comprising a biocompatible metal powder and a spacing agent; b. compressing the powder mixture onto a metal base, the metal base comprising a solid metal layer of material taken from a solid metal block; c. removing the spacing agent to form a compact having a porous metal structure pressed on the metal base; d. sintering adjacent powder particles of the porous metal structure to one another while concurrently sintering the porous structure to the metal base to form a subassembly; e. aligning the subassembly with a metal substrate component; and f. forming a metallurgical bond by diffusion bonding the metal base of the subassembly and the metal substrate component to form an implant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 17)
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10. A method for preparing an implant having a porous metal component, comprising:
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a. preparing a loose powder mixture comprising a biocompatible metal powder and a spacing agent; b. compressing the powder mixture onto a solid metal base defining a metal surface; c. heating the compressed powder mixture and defining a plurality of pores therein to form a compact; e. sintering the compact to form a subassembly comprising a porous metal structure having a non-porous solid metal backing; f. aligning the solid metal backing of the subassembly with a metal substrate component; and g. diffusion bonding the solid metal backing to the metal substrate component to form an implant. - View Dependent Claims (11, 12, 13)
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14. A method for preparing an implant having a porous metal component, comprising:
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a. placing a base layer comprising a biocompatible solid metal layer into a mold; b. preparing a loose powder mixture of a biocompatible metal powder and a spacing agent; c. forming a secondary layer by spreading the loose powder mixture in the mold on top of the base layer; d. applying a compressive force to the mold thereby compressing the loose powder mixture of the secondary layer, and pressing the secondary layer onto the base layer; e. removing the spacing agent, defining a plurality of pores within the secondary layer; f. sintering the mold contents, including sintering adjacent powder particles of the secondary layer to one another while concurrently sintering the secondary layer to the base layer to form a subassembly including a porous metal structure having a solid metal backing; and g. diffusion bonding the solid metal backing of the subassembly to a metal substrate component of an implant, forming an implant. - View Dependent Claims (15, 16)
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Specification