Semiconductor package having an antenna with reduced area and method for fabricating the same

• US 8,383,463 B2
• Filed: 07/20/2011
• Issued: 02/26/2013
• Est. Priority Date: 12/10/2008
• Status: Expired due to Fees

• Current Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Original Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Inventors: Kang, Tae Min
• Primary Examiner(s): Smith, Bradley K
• Assistant Examiner(s): Karimy, Timor
• Application Number:
  US13/186,713
• Publication Number:
  US 20110275181A1
• Time in Patent Office: 587 Days
• Field of Search: 438/127, 257/659, 257/E21.502
• US Class Current: 438/127
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/48 : Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.

Claims

1. A method for fabricating a semiconductor package, comprising:

preparing an electromagnetic shielding member for shielding electromagnetic waves;

forming RFID chip ball lands on the electromagnetic shielding member;

forming a preliminary antenna connecting the RFID chip ball lands on an upper face of the electromagnetic shielding member, wherein the preliminary antenna comprises conductive polarized particles respectively having different polarities and a flowable insulation material;

applying power having different polarities to the respective RFID chip ball lands so as to electrically connect the conductive polarized particles within the flowable insulation material;

curing the flowable insulation material;

electrically connecting terminals of an RFID chip to the respective RFID chip ball lands;

attaching the electromagnetic shielding member to the semiconductor package; and

molding the RFID chip of the electromagnetic shielding member and the semiconductor package with a molding member.

2. The method of claim 1, wherein in the step of attaching the electromagnetic shielding member to the semiconductor package, the electromagnetic shielding member is attached onto the semiconductor chip included in the semiconductor package or a substrate.

3. The method of claim 1, further comprising:

forming a plurality of RFID reader ball lands on at least one of the electromagnetic shielding member and the substrate;

electrically connecting the RFID reader ball lands to an RFID reader for communicating with an external RFID chip positioned outside the semiconductor chip;

forming an RFID reader antenna electrically connected to the RFID reader ball lands.

4. The method of claim 3, further comprising:

forming a thin secondary cell between the substrate and the semiconductor chip.