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Semiconductor package having an antenna with reduced area and method for fabricating the same

  • US 8,383,463 B2
  • Filed: 07/20/2011
  • Issued: 02/26/2013
  • Est. Priority Date: 12/10/2008
  • Status: Expired due to Fees
First Claim
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1. A method for fabricating a semiconductor package, comprising:

  • preparing an electromagnetic shielding member for shielding electromagnetic waves;

    forming RFID chip ball lands on the electromagnetic shielding member;

    forming a preliminary antenna connecting the RFID chip ball lands on an upper face of the electromagnetic shielding member, wherein the preliminary antenna comprises conductive polarized particles respectively having different polarities and a flowable insulation material;

    applying power having different polarities to the respective RFID chip ball lands so as to electrically connect the conductive polarized particles within the flowable insulation material;

    curing the flowable insulation material;

    electrically connecting terminals of an RFID chip to the respective RFID chip ball lands;

    attaching the electromagnetic shielding member to the semiconductor package; and

    molding the RFID chip of the electromagnetic shielding member and the semiconductor package with a molding member.

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