Structure of bus bar assembly

• US 8,383,939 B2
• Filed: 10/26/2010
• Issued: 02/26/2013
• Est. Priority Date: 11/27/2009
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Gotou, Yukio
• Primary Examiner(s): Estrada, Angel R
• Application Number:
  US12/911,992
• Publication Number:
  US 20110127061A1
• Time in Patent Office: 854 Days
• Field of Search: 174/72.B, 174/71.B, 174/88.B, 174/70.B, 174/99.B, 174/129.B, 174/133.B, 174/149.B, 174/68.2, 361/600, 361/601, 361/624, 361/627, 361/637, 361/639, 361/648, 361/675, 361/641, 361/611, 439/212, 439/213, 439/114, 439/210
• US Class Current: 174/68.2
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A bus bar assembly used for establish electric connections with semiconductor modules of an electric power converter. The bus bar assembly includes a resinous body, a first and a second bus bar to which terminals of the semiconductor modules are to be connected. Each of the first and second bus bars includes a plate body and a plurality of connecting terminals extending from the plate body substantially in parallel to a major surface of the plate body. At least a portion of the body plate of the first bus bar is disposed inside the resinous body. The second bus bar is mounted at the plate body on the resinous body and laid to overlap the first bus bar at a given distance away from the first bus bar. This structure minimizes the misalignment between the first and second bus bars after the resinous body is formed.

Claims

1. A bus bar assembly comprising:

a resinous body;

a first bus bar to which electrode terminals of semiconductor modules of an electric power converter are to be connected electrically, said first bus bar being made of a conductive plate which includes a plate body and a plurality of connecting terminals extending from the plate body substantially in parallel to a major surface of the plate body to establish electric connections with the electrode terminals of the semiconductor modules, at least a portion of the body plate of said first bus bar being disposed inside said resinous body, said resinous body having an exterior seat surface that extends in parallel to the major surface of the plate body of the first bus bar; and

a second bus bar to which electrode terminals of the semiconductor modules of the electric power converter are to be connected electrically, said second bus bar being made of a conductive plate which includes a plate body and a plurality of connecting terminals extending from the plate body substantially in parallel to a major surface of the plate body to establish electric connections with the electrode terminals of the semiconductor modules, the plate body of said second bus bar being seated on and fixed to said exterior seat surface of said resinous body so that said second bus bar extends in parallel to said first bus bar at a given distance spaced away from said first bus bar.

2. A bus bar assembly as set forth in claim 1, wherein said resinous body has formed therein a front opening through which a portion of a front surface of the plate body of said first bus bar is exposed outside said resinous body and a back opening through which a portion of a back surface of the plate body of said first bus bar is exposed outside said resinous body, the front and back openings being aligned in a thickness-wise direction of said resinous body, said resinous body also having formed thereon a boss extending from said exterior seat surface of said resinous body around the front opening, and wherein said second bus bar has a positioning opening in which the boss is fit to fix a positional relation of said second bus bar relative to said resinous body.

3. A bus bar assembly as set forth in claim 2, wherein said first bus bar has a hole formed to extend through the portions of the front surface and the back surface of the plate body of said first bus bar exposed through the front and back openings, the hole being smaller in diameter than the front and back openings.

4. A bus bar assembly as set forth in claim 2, wherein said resinous body also has formed therein a second front opening through which a portion of the front surface of the plate body of said first bus bar is exposed outside said resinous body and a second back opening through which a portion of the back surface of the plate body of said first bus bar is exposed outside said resinous body, the second front and back openings being aligned in the thickness-wise direction of said resinous body, said resinous body also having formed thereon a second boss extending from the exterior seat, surface of said resinous body around the second front opening, and wherein said second bus bar has a second positioning opening in which the second boss is fit to fix the positional relation of said second bus bar relative to said resinous body.

5. A bus bar assembly as set forth in claim 2, wherein the boss has a height in the thickness-wise direction of said resinous body that is greater than a thickness of the second bus bar.

6. A bus bar assembly comprising:

a resinous body;

a first bus bar to which electrode terminals of semiconductor modules of an electric power converter are to be connected electrically, said first bus bar being made of a conductive plate which includes a plate body and a plurality of connecting terminals extending from the plate body substantially in parallel to a major surface of the plate body to establish electric connections with the electrode terminals of the semiconductor modules, at least a portion of the body plate of said first bus bar being disposed inside said resinous body; and

a second bus bar to which electrode terminals of the semiconductor modules of the electric power converter are to be connected electrically, said second bus bar being made of a conductive plate which includes a plate body and a plurality of connecting terminals extending from the plate body substantially in parallel to a major surface of the plate body to establish electric connections with the electrode terminals of the semiconductor modules, said second bus bar being mounted at the plate body on said resinous body and laid to overlap said first bus bar at a given distance away from said first bus bar,

wherein said resinous body has formed therein a front opening through which a portion of a front surface of the plate body of said first bus bar is exposed outside said resinous body and a back opening through which a portion of a back surface of the plate body of said first bus bar is exposed outside said resinous body, the front and back openings being aligned in a thickness-wise direction of said resinous body, said resinous body also having formed thereon a boss extending from a major surface of said resinous body around the front opening, and wherein said second bus bar has a positioning opening in which the boss is fit to fix a positional relation of said second bus bar relative to said resinous body.

7. A bus bar assembly as set forth in claim 6, wherein said first bus bar has a hole formed to extend through the portions of the front surface and the back surface of the plate body of said first bus bar exposed through the front and back openings, the hole being smaller in diameter than the front and back openings.

8. A bus bar assembly as set forth in claim 6, wherein said resinous body also has formed therein a second front opening through which a portion of the front surface of the plate body of said first bus bar is exposed outside said resinous body and a second back opening through which a portion of the back surface of the plate body of said first bus bar is exposed outside said resinous body, the second front and back openings being aligned in the thickness-wise direction of said resinous body, said resinous body also having formed thereon a second boss extending from the major surface of said resinous body around the second front opening, and wherein said second bus bar has a second positioning opening in which the second boss is fit to fix the positional relation of said second bus bar relative to said resinous body.

9. A bus bar assembly as set forth in claim 6, wherein the boss extends above a thickness of the second bus bar.