Sensor device with sealing structure
First Claim
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1. A sensor device comprising:
- a sensor structure including a first portion having a sensing arrangement formed thereon;
control circuitry to determine a pressure metric indicative of the ambient pressure based on an electrical signal from the sensing arrangement;
a second structure comprising an integrated circuit die having the control circuitry formed thereon; and
a sealing structure interposed between the sensor structure and the second structure, the sealing structure surrounding the first portion of the sensor structure to establish a fixed reference pressure on a first side of the first portion, wherein a second side of the first portion is exposed to an ambient pressure.
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Abstract
Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
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Citations
20 Claims
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1. A sensor device comprising:
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a sensor structure including a first portion having a sensing arrangement formed thereon; control circuitry to determine a pressure metric indicative of the ambient pressure based on an electrical signal from the sensing arrangement; a second structure comprising an integrated circuit die having the control circuitry formed thereon; and a sealing structure interposed between the sensor structure and the second structure, the sealing structure surrounding the first portion of the sensor structure to establish a fixed reference pressure on a first side of the first portion, wherein a second side of the first portion is exposed to an ambient pressure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A pressure sensor device comprising:
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a pressure sensor structure including a diaphragm region having a sensing arrangement formed on a first side of the pressure sensor structure, wherein a second side of the diaphragm region is exposed to an ambient pressure; a metal material circumscribing the diaphragm region, the metal material being bonded to the first side of the pressure sensor structure; and a substrate having a planar surface, wherein the metal material is bonded to the planar surface of the substrate to establish a chamber on the first side of the diaphragm region having a fixed reference pressure, wherein the substrate comprises a semiconductor substrate having an application-specific integrated circuit formed thereon, the application-specific integrated circuit being coupled to the sensing arrangement to determine a pressure metric indicative of the ambient pressure based on an electrical signal from the sensing arrangement. - View Dependent Claims (12)
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13. A pressure sensor device comprising:
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a pressure sensor structure including a diaphragm region having a sensing arrangement formed on a first side of the pressure sensor structure, wherein a second side of the diaphragm region is exposed to an ambient pressure; a metal material circumscribing the diaphragm region, the metal material being bonded to the first side of the pressure sensor structure; a substrate having a planar surface, wherein the metal material is bonded to the planar surface of the substrate to establish a chamber on the first side of the diaphragm region having a fixed reference pressure; and a protective material formed on the second side of the diaphragm region. - View Dependent Claims (14)
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15. A pressure sensor device comprising:
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a pressure sensor structure including a diaphragm region having a sensing arrangement formed on a first side of the pressure sensor structure; a metal material circumscribing the diaphragm region, the metal material being bonded to the first side of the pressure sensor structure; a substrate having a planar surface, wherein the metal material is bonded to the planar surface of the substrate to establish a chamber having a fixed reference pressure; and a molding compound disposed between the pressure sensor structure and the substrate, the molding compound surrounding the metal material. - View Dependent Claims (16, 17, 18)
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19. A sensor device comprising:
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a sensor structure including a cavity and a diaphragm region having a sensing arrangement formed thereon; a substrate; a sealing structure bonded to a first side of the sensor structure and the substrate, the sealing structure circumscribing the diaphragm region on the first side of the sensor structure; and a capping member bonded to the substrate, the capping member covering the sensor structure to establish a fixed reference pressure on a second side of the sensor structure, wherein the substrate includes a hole formed therein, the diaphragm region being aligned with the hole to expose the first side of the diaphragm region opposite the cavity to an ambient pressure. - View Dependent Claims (20)
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Specification