Method and system for MEMS switches fabricated in an integrated circuit package

• US 8,384,500 B2
• Filed: 12/13/2007
• Issued: 02/26/2013
• Est. Priority Date: 12/13/2007
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): Takaoka, Dean O
• Application Number:
  US11/956,106
• Publication Number:
  US 20120313723A1
• Time in Patent Office: 1,902 Days
• Field of Search: 333/101, 333/103, 333/104, 333/105, 333/262, 200/181, 335/78
• US Class Current: 333/262
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01P 1/10 for switching or interrupting in systems using reflection or reradiation of radio, acoustic or other waves G01S7/034
• CPC Class Codes: H01P 1/127 Strip line switches
• CPC Class Codes: H01P 3/003 Coplanar lines
• CPC Class Codes: H04B 1/48 in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter H04B1/46 takes precedence

Abstract

Methods and systems for MEMS switches fabricated in an integrated circuit package are disclosed and may include controlling switching of RF components, and signals handled by the RF components, within an integrated circuit. One or more MEMS switch arrays embedded within a multi-layer package bonded to the integrated circuit may be utilized for the switching and signal control. The RF components and one or more MEMS switch arrays may be integrated in the multi-layer package. The RF components may be electrically coupled to the integrated circuit via the one or more MEMS switch arrays. The MEMS switch arrays may be electrostatically or magnetically activated. The RF components may be coupled to one or more capacitor arrays in the integrated circuit. The RF components may include transformers, inductors, transmission lines, microstrip and/or coplanar waveguide filters and/or surface mount devices. The integrated circuit may be coupled to the multiple-layer package utilizing a flip-chip bonding technique.

Claims

1. A method for wireless communication, the method comprising:

in a wireless system, controlling switching of RF components and signals handled by said RF components within an integrated circuit via one or more MEMS switch arrays integrated with a multi-layer package bonded to said integrated circuit;

wherein at least one MEMS switch in said one or more MEMS switch arrays comprises a bridge membrane supported on each end by an input terminal.

2. The method according to claim 1, comprising tuning said one or more RF components via said one or more MEMS switch arrays.

3. The method according to claim 1, comprising switching said one or more RF components via said one or more MEMS switch arrays.

4. The method according to claim 1, wherein said one or more MEMS switch arrays are magnetically activated or electrostatically activated.

5. The method according to claim 1, wherein said RF components are coupled to one or more capacitor arrays within said integrated circuit.

6. The method according to claim 1, wherein said RF components comprise transformers.

7. The method according to claim 1, wherein said RF components comprise inductors.

8. The method according to claim 1, wherein said RF components comprise MEMS switch configured transmission lines.

9. The method according to claim 1, wherein said RF components comprise microstrip and/or coplanar waveguide filters.

10. The method according to claim 1, wherein said RF components comprise surface mount devices.

11. The method according to claim 1, wherein said integrated circuit is electrically coupled to said multiple-layer package via a flip-chip bonding technique.

12. A system for wireless communication, the system comprising:

a multi-layer package bonded to an integrated circuit, wherein said multi-layer package comprises integrated RF components and one or more MEMS switch arrays, and wherein said RE components are electrically coupled to said integrated circuit via said one or more MEMS switch arrays;

wherein at least one MEMS switch in said one or more MEMS switch arrays comprises a bridge membrane supported on each end by an input terminal.

13. The system according to claim 12, wherein said one or more RF components are tuned via said one or more MEMS switch arrays and/or said integrated circuit.

14. The system according to claim 12, wherein said one or more RF components are switched via said one or more MEMS switch arrays and/or said integrated circuit.

15. The system according to claim 12, wherein said one or more MEMS switch arrays are magnetically activated or electrostatically activated.

16. The system according to claim 12, wherein said RF components are coupled to one or more capacitor arrays in said integrated circuit.

17. The system according to claim 12, wherein said RF components comprise transformers.

18. The system according to claim 12, wherein said RF components comprise inductors.

19. The system according to claim 12, wherein said RF components comprise MEMS switch configured transmission lines.

20. The system of claim 12, wherein said RF components comprise microstrip and/or coplanar waveguide filters.

21. The system of claim 12, wherein said RF components comprise surface mount devices.

22. The system of claim 12, wherein said integrated circuit is coupled to said multiple-layer package utilizing a flip-chip bonding technique.