Method and system for inter-chip communication via integrated circuit package antennas

• US 8,384,596 B2
• Filed: 08/14/2008
• Issued: 02/26/2013
• Est. Priority Date: 06/19/2008
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): LE, HOANGANH T
• Application Number:
  US12/191,738
• Publication Number:
  US 20090315797A1
• Time in Patent Office: 1,657 Days
• Field of Search: 343/700.MS, 343/702, 343/787, 296/00
• US Class Current: 343/700.MS
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

Methods and systems for inter-chip communication via integrated circuit package antennas are disclosed and may include communicating one or more signals between or among a plurality of integrated circuits via one or more antennas integrated in a multi-layer package. The integrated circuits may be bonded to the multi-layer package. The antennas may be configured via switches in the integrated circuits or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The antennas may comprise metal and/or ferromagnetic layers deposited on and/or embedded within the multi-layer package.

Claims

1. A method for wireless communication, the method comprising:

configuring a frequency of one or more antennas integrated in a multi-layer package via switches integrated within said multi-layer package;

communicating signals between or among a plurality of integrated circuits integrated in said multi-layer package via said one or more antennas

wherein at least one of said signals comprises a microwave frequency communication signal, and at least one lower frequency control signal is communicated via conductive lines in said multilayer package to configure said communication of said signals.

2. The method according to claim 1, wherein said switches are integrated within said plurality of integrated circuits.

3. The method according to claim 1, wherein said switches are MEMS switches.

4. The method according to claim 1, wherein said microwave frequency communication signal comprises a microwave signal at a frequency of 60 GHz or greater.

5. The method according to claim 1, wherein said low frequency control signal comprises a digital signal.

6. The method according to claim 1, wherein said one or more antennas comprise metal layers deposited on said multi-layer package.

7. The method according to claim 1, wherein said one or more antennas comprise metal layers embedded within said multi-layer package.

8. The method according to claim 1, wherein said one or more antennas comprise ferromagnetic layers deposited on said multi-layer package.

9. The method according to claim 1, wherein said one or more antennas comprise ferromagnetic layers embedded within said multi-layer package.

10. A system for wireless communication, the system comprising:

one or more antennas integrated in a multi-layer package;

one or more circuits in each of a plurality of integrated circuits bonded to said multilayer package, wherein said one or more circuits are configured to;

configure a frequency of said one or more antennas via switches integrated within said multi-layer package;

communicate signals between or among each of said plurality of integrated circuits via said one or more antennas;

wherein at least one of said signals comprises a microwave frequency communication signal, and at least one lower frequency control signal is communicated via conductive lines in said multi-layer package to configure said communication of said signals.

11. The system according to claim 10, wherein said switches are integrated within said plurality of integrated circuits.

12. The system according to claim 10, wherein said switches are MEMS switches.

13. The system according to claim 10, wherein said microwave frequency communication signal comprises a microwave signal at a frequency of 60 GHz or greater.

14. The system according to claim 10, wherein said low frequency control signal comprises a digital signal.

15. The system according to claim 10, wherein said one or more antennas comprise metal layers deposited on said multi-layer package.

16. The system according to claim 10, wherein said one or more antennas comprise metal layers embedded within said multi-layer package.

17. The system according to claim 10, wherein said one or more antennas comprise ferromagnetic layers deposited on said multi-layer package.

18. The system according to claim 10, wherein said one or more antennas comprise ferromagnetic layers embedded within said multi-layer package.