Electronic component mounting apparatus and stopping method of electronic component mounting apparatus

• US 8,386,063 B2
• Filed: 12/26/2008
• Issued: 02/26/2013
• Est. Priority Date: 12/26/2007
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Ogata, Yuji
• Primary Examiner(s): Kasenge, Charles R
• Assistant Examiner(s): STEVENS, THOMAS H
• Application Number:
  US12/808,583
• Publication Number:
  US 20100268369A1
• Time in Patent Office: 1,523 Days
• Field of Search: 414/222.01, 700/95, 700/96, 700/108, 700/110, 700/112, 700/116, 700/117, 700/122, 700/159, 700/204, 700/230
• US Class Current: 700/110
• CPC Class Codes: H05K 13/0888 Ergonomics; Operator safety; Training; Failsafe systems

Abstract

A foreign matter detection unit detects an entry of an unexpected foreign matter that is other than the substrates by light transmitting optical sensors 7 having light projecting portions 7a and light receiving portions 7b at opening sections 3a, 3b formed in cover members 2 through which the substrates pass. By executing an emergency stop processing, when the entry of the foreign matter is detected at one of the opening sections, to stop the electronic component mounting apparatus that is adjacent to the opening section at which the entry of the foreign matter is detected, safety of the machine operators is properly ensured in check and confirmation works conducted at the time of machine troubles etc even in an electronic component assembling line in which the small-sized thin unit apparatuses are combined.

Claims

1. An electronic component mounting apparatus having a plurality of electronic component loading apparatuses combined to constitute an electronic component assembling line in which component-mounted substrates are manufactured by mounting electronic components on substrates, the electronic component mounting apparatus comprising:

a substrate carry unit constituting a carrying path of the electronic component assembling line arranged between an upstream end and a downstream end thereof to carry the substrates;

a working operation unit executing a working operation to mount components to the substrates that are carried by the substrate carry unit;

a pair of opening sections through which the substrates pass and which are located at the upstream end and the downstream end of the substrate carry unit and formed in cover members, wherein each of the cover members covers each of the electronic component loading apparatuses,

a foreign matter detection unit detecting an entry of an unexpected foreign matter that is other than the substrates through the opening sections located at the upstream end and the downstream end;

an adjacent apparatus stop processing unit executing an emergency stop processing, when the entry of the foreign matter is detected at one of the opening sections, to stop the electronic component mounting apparatus that is adjacent to the opening section at which the entry of the foreign matter is detected.

2. An electronic component mounting apparatus according to claim 1, further comprising:

a cover lid provided on a side of an operation face in the electronic component mounting apparatus so as to be openable and closable such that an operator is accessible to an operation area in the working operation unit; and

a lid open/close detection unit detecting opening and closing of the cover lid,

wherein the adjacent apparatus stop processing unit executes the emergency stop processing to stop the adjacent electronic component mounting apparatus only in a case that the lid open/close detection unit detects opening of the cover lid and the foreign matter detection unit detects the entry of the foreign matter.

3. A stopping method of an electronic component mounting apparatus in an emergency having a plurality of electronic component loading apparatuses combined to constitute an electronic component assembling line in which component-mounted substrates are manufactured by mounting electronic components on substrates, the electronic component mounting apparatus comprising:

a substrate carry unit provided with a carrying path arranged between an upstream end and a downstream end thereof to carry the substrates in the electronic component assembling line;

a working operation unit executing a working operation to mount components to the substrates that are carried by the substrate carry unit;

a pair of opening sections through which the substrates pass and which are located at the upstream end and the downstream end of the substrate carry unit and formed in cover members, wherein each of the cover members covers each of the electronic component loading apparatuses,

a foreign matter detection unit detecting an entry of an unexpected foreign matter that is other than the substrates through the opening sections located at the upstream end and the downstream end;

wherein an emergency stop processing is executed, when the entry of the foreign matter is detected at one of the opening sections, to stop the electronic component mounting apparatus that is adjacent to the opening section at which the entry of the foreign matter is detected.

4. A stopping method of an electronic component mounting apparatus in an emergency according to claim 3, the electronic component mounting apparatus, further comprising:

a cover lid provided on a side of an operation face in the electronic component mounting apparatus so as to be openable and closable such that an operator is accessible to an operation area in the working operation unit; and

a lid open/close detection unit detecting opening and closing of the cover lid,

wherein the emergency stop processing to stop the adjacent electronic component mounting apparatus is executed only in a case that the lid open/close detection unit detects opening of the cover lid and the foreign matter detection unit detects the entry of the foreign matter.