Memory systems and memory modules
First Claim
1. A memory module, comprising:
- at least one memory chip; and
a first intelligent chip coupled to the at least one memory chip and adapted to be coupled to a memory controller, wherein the intelligent chip is configured to implement at least a part of a reliability and serviceability (RAS) feature; and
a second intelligent chip coupled to the at least one memory chip and adapted to be coupled to the memory controller, and a sideband bus that couples the intelligent chip to the second intelligent chip,wherein information is communicated over the sideband bus to prompt either the intelligent chip or second intelligent chip to substitute data from good memory bits in the at least one memory chip for data from known bad memory bits in the at least one memory chip using a lookaside buffer.
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Accused Products
Abstract
One embodiment of the present invention sets forth a memory module that includes at least one memory chip, and an intelligent chip coupled to the at least one memory chip and a memory controller, where the intelligent chip is configured to implement at least a part of a RAS feature. The disclosed architecture allows one or more RAS features to be implemented locally to the memory module using one or more intelligent register chips, one or more intelligent buffer chips, or some combination thereof. Such an approach not only increases the effectiveness of certain RAS features that were available in prior art systems, but also enables the implementation of certain RAS features that were not available in prior art systems.
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Citations
9 Claims
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1. A memory module, comprising:
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at least one memory chip; and a first intelligent chip coupled to the at least one memory chip and adapted to be coupled to a memory controller, wherein the intelligent chip is configured to implement at least a part of a reliability and serviceability (RAS) feature; and a second intelligent chip coupled to the at least one memory chip and adapted to be coupled to the memory controller, and a sideband bus that couples the intelligent chip to the second intelligent chip, wherein information is communicated over the sideband bus to prompt either the intelligent chip or second intelligent chip to substitute data from good memory bits in the at least one memory chip for data from known bad memory bits in the at least one memory chip using a lookaside buffer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification