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Laterally integrated MEMS sensor device with multi-stimulus sensing

  • US 8,387,464 B2
  • Filed: 11/30/2009
  • Issued: 03/05/2013
  • Est. Priority Date: 11/30/2009
  • Status: Active Grant
First Claim
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1. A microelectromechanical systems (MEMS) sensor device comprising:

  • a substrate having a first side and a second side that opposes said first side;

    a first sensor disposed on said first side of said substrate at a first location;

    a second sensor disposed on said first side of said substrate at a second location, said second sensor including a sense element, and said substrate including a cavity at said second location and extending through said substrate from said second side to expose said sense element to an environment external to said MEMS sensor device; and

    a cap coupled with said first side of said substrate to form a hermetically sealed chamber in which both of said first sensor and said second sensor are located.

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