RFID-containing carriers used for silicon wafer quality

• US 8,388,410 B2
• Filed: 11/05/2007
• Issued: 03/05/2013
• Est. Priority Date: 11/05/2007
• Status: Active Grant

• Current Assignee: P.R. Hoffman Machine Products, Inc. (Amtech Systems, Inc.)
• Original Assignee: P.R. Hoffman Machine Products, Inc. (Amtech Systems, Inc.)
• Inventors: Albright, John Wesley Jr.
• Primary Examiner(s): Rachuba, Maurina
• Application Number:
  US11/935,283
• Publication Number:
  US 20090114549A1
• Time in Patent Office: 1,947 Days
• Field of Search: 451/5, 451/8, 451/41, 451/262, 451/268, 451/269, 451285-290, 700/121, 700/116, 700/115, 700/174
• US Class Current: 451/8
• CPC Class Codes: B24B 37/16 characterised by the shape of the lapping plate surface, e.g. grooved

Abstract

A carrier configured for use in a lapping machine includes a body having a first opening for carrying a work piece during operation of the lapping machine. A device is arranged and disposed in the body. The device is configured to retain information readable by a reading device for identifying the body.

Claims

1. A carrier for use in a lapping machine comprising:

a body having a first opening for holding a work piece composed of a semiconductor or a rigid material having opposed surfaces against and between corresponding opposed surfaces of a lapping machine, resulting in abrasive contact between the corresponding opposed surfaces of the work piece and the lapping machine during movement of the opposed surfaces of the lapping machine with respect to the opposed surfaces of the work piece, the body having opposed surfaces in close proximity with the opposed surfaces of the lapping machine; and

a device arranged and disposed in the body between the opposed surfaces, the device configured to retain information readable by a reading device for only identifying the body in association with processing a work piece in the lapping machine.

2. The carrier of claim 1, wherein the device is a radio frequency identification marker.

3. The carrier of claim 1, wherein the substance is a plastic.

4. The carrier of claim 1, wherein the substance is an adhesive.

5. The carrier of claim 1, wherein the substance is provided in different colors.

6. The carrier of claim 1, wherein the device is disposed in a second opening, the first and second opening forming a single opening.

7. The carrier of claim 1, wherein the device is substantially surrounded by a substance fixedly securing the device in the body, the body information is configured to be readable through the substance by the reading device.

8. A method for providing quality control associated with processing of work pieces in a lapping machine, the method comprising:

providing a body having a first opening for holding opposed surfaces of a work piece composed of a semiconductor or a rigid material against and between corresponding opposed surfaces of a lapping machine, resulting in abrasive contact between the corresponding opposed surfaces of the work piece and the lapping machine during movement of the opposed surfaces of the lapping machine with respect to the opposed surfaces of the work piece;

positioning a device in the body, the device configured to retain information readable by a reading device only associated with identification of the body in association with processing a work piece in the lapping machine; and

reading the device information by the reading device.

9. The method of claim 8, wherein a substance is used to position the device in the body.

10. The method of claim 9, wherein the reading device is configured to read device information through the substance.

11. The method of claim 9, wherein the substance is provided in difference colors.

12. The method of claim 8, wherein reading the device information includes information associated with identification of the body.

13. A carrier for use in a lapping machine comprising:

a body having a first opening for holding a first work piece and a second opening for holding a second work piece, the first work piece and the second work piece composed of a semiconductor or a rigid material having opposed surfaces against and between corresponding opposed surfaces of a lapping machine, resulting in abrasive contact between the corresponding opposed surfaces of the work pieces and the lapping machine during movement of the opposed surfaces of the lapping machine with respect to the opposed surfaces of the work pieces, the body having opposed surfaces in close proximity with the opposed surfaces of the lapping machine; and

a first device arranged and disposed in the body between the opposed surfaces and in close proximity to the first opening and a second device arranged and disposed in the body between the opposed surfaces and in close proximity to the second opening, the first device and the second device configured to retain information readable by a reading device for only identifying the corresponding first opening in the body and the second opening in the body in association with processing the corresponding first work piece and second work piece in the lapping machine.