Apparatuses and methods for manipulating droplets

• US 8,388,909 B2
• Filed: 10/09/2009
• Issued: 03/05/2013
• Est. Priority Date: 09/24/2002
• Status: Expired due to Fees

• Current Assignee: Duke University, Advanced Liquid Logic, Inc. (Illumina Incorporated)
• Original Assignee: Duke University
• Inventors: Pollack, Michael G, Pamula, Vamsee K, Fair, Richard B
• Primary Examiner(s): Warden, Jill
• Assistant Examiner(s): Handy, Dwayne K
• Application Number:
  US12/576,794
• Publication Number:
  US 20100025242A1
• Time in Patent Office: 1,243 Days
• Field of Search: 422/82.05, 422/100, 422/102, 422/501, 422/502, 422/503, 422/504, 436/53, 436/180, 204/450, 204600-603
• US Class Current: 422/504
• CPC Class Codes: B01F 33/3021 the components to be mixed being combined in a single independent droplet, e.g. these droplets being divided by a non-miscible fluid or consisting of independent droplets
• CPC Class Codes: B01F 33/3031 using electro-hydrodynamic [EHD] or electro-kinetic [EKI] phenomena to mix or move the fluids
• CPC Class Codes: B01L 2200/0673 Handling of plugs of fluid surrounded by immiscible fluid
• CPC Class Codes: B01L 2200/10 Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0663 Whole sensors
• CPC Class Codes: B01L 2300/0819 Microarrays; Biochips
• CPC Class Codes: B01L 2300/0864 comprising only one inlet and multiple receiving wells, e.g. for separation, splitting
• CPC Class Codes: B01L 2300/0867 Multiple inlets and one sample wells, e.g. mixing, dilution
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/089 Virtual walls for guiding liquids
• CPC Class Codes: B01L 2300/12 Specific details about materials
• CPC Class Codes: B01L 2300/1827 using resistive heater
• CPC Class Codes: B01L 2400/0415 electrical forces, e.g. electrokinetic
• CPC Class Codes: B01L 2400/0424 Dielectrophoretic forces
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502792 for moving individual droplets on a plate, e.g. by locally altering surface tension
• CPC Class Codes: B01L 7/52 with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples amplification or hybridisation processes per se C12Q1/68; controlling sequential reactions for synthesis B01J19/0046
• CPC Class Codes: B81B 2201/058 Microfluidics not provided for in B81B2201/051 - B81B2201/054
• CPC Class Codes: B81B 3/0021 : Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81C 1/00119 : Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
• CPC Class Codes: C12Q 1/6846 : Common amplification features
• CPC Class Codes: G01N 27/447 : using electrophoresis
• CPC Class Codes: G01N 27/44769 : Continuous electrophoresis, i.e. the sample being continuously introduced, e.g. free flow electrophoresis [FFE]
• CPC Class Codes: G01N 27/44791 : Microapparatus sample containers with integrated microfluidic structures B01L3/5027
• CPC Class Codes: G05D 7/0694 : by action on throttling means or flow sources of very small size, e.g. microfluidics microvalves F16K99/0001; microstructural devices per se B81B
• CPC Class Codes: H01L 21/6715 : Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: Y10T 436/2575 : Volumetric liquid transfer

Abstract

Apparatuses and methods for manipulating droplets are disclosed. In one embodiment, an apparatus for manipulating droplets is provided, the apparatus including a substrate, multiple arrays of electrodes disposed on the substrate, wherein corresponding electrodes in each array are connected to a common electrical signal, and a dielectric layer disposed on the substrate first side surface and patterned to cover the electrodes.

Claims

1. An apparatus for manipulating droplets, the apparatus comprising:

(a) a printed circuit board substrate comprising a rigid or rigid-flexible base material made from plastic, glass fiber epoxy, polytetrafluoroethylene, or polyimide;

(b) multiple arrays of electrowetting electrodes disposed on the substrate, wherein corresponding electrodes in each array are connected to a common electrical signal, the arrays forming a phased droplet conveyor;

(c) a dielectric layer disposed on the substrate and patterned to cover the electrowetting electrodes; and

(d) an electrowetting electrode selector configured for dynamically creating a sequence of array electrowetting electrode activation to transport a droplet on the phased droplet conveyor.

2. The apparatus of claim 1 further comprising a hydrophobic layer disposed on the dielectric layer.

3. The apparatus of claim 1 further comprising a top plate arranged in a parallel orientation relative to the substrate and separated therefrom to define a gap between the top plate and the substrate.

4. The apparatus of claim 1 further comprising a droplet in disposed in the gap and arranged to be manipulated using electrowetting electrodes in the electrowetting electrode arrays.

5. The apparatus of claim 4 wherein the gap comprises a liquid which is immiscible with the droplet.

6. The apparatus of claim 1 further comprising droplets disposed in the gap, wherein the droplets are arranged synchronously transported on the multiple arrays using a fixed number of control signals.

7. The apparatus of claim 6 wherein the gap comprises a liquid which is immiscible with the droplet.

8. The apparatus of claim 1 wherein the arrays of electrowetting electrodes comprise multiple copies of a single linear array of electrowetting electrodes.

9. The apparatus of claim 8 wherein each copy of the array is connected to the same electrical signals.

20. The apparatus of claim 1 wherein the printed circuit board substrate comprises single boards comprising metal layers and bonded together.

21. The apparatus of claim 1 wherein the printed circuit board substrate comprises electrowetting electrodes formed by patterning of copper foils.

22. The apparatus of claim 1 wherein the printed circuit board substrate is made from plastic.

23. The apparatus of claim 1 wherein the printed circuit board substrate is made from glass fiber epoxy.

24. The apparatus of claim 1 wherein the printed circuit board substrate is made from polytetrafluoroethylene.

25. The apparatus of claim 1 wherein the printed circuit board substrate is made from polyimide.

10. An apparatus for manipulating droplets, the apparatus comprising:

(a) a printed circuit board substrate comprising a rigid or rigid-flexible base material made from plastic, glass fiber epoxy, polytetrafluoroethylene, or polyimide;

(b) a top plate arranged in a parallel orientation relative to the substrate and separated therefrom to define a gap between the top plate and the substrate;

(c) multiple arrays of electrowetting electrodes disposed on the substrate, wherein corresponding electrowetting electrodes in each array are connected to a common electrical signal, the arrays forming a phased droplet conveyor; and

(d) a dielectric layer disposed on the substrate and patterned to cover the electrowetting electrodes.

26. The apparatus of claim 10 wherein the printed circuit board substrate comprises single boards comprising metal layers and bonded together.

27. The apparatus of claim 10 wherein the electrowetting electrodes are formed by patterning of copper foils.

28. The apparatus of claim 10 wherein the printed circuit board substrate is made from plastic.

29. The apparatus of claim 10 wherein the printed circuit board substrate is made from glass fiber epoxy.

30. The apparatus of claim 10 wherein the printed circuit board substrate is made from polytetrafluoroethylene.

31. The apparatus of claim 10 wherein the printed circuit board substrate is made from polyimide.

11. A method of manipulating a droplet, the method comprising:

(a) providing an apparatus comprising;

(i) a printed circuit board substrate comprising a rigid or rigid-flexible base material made from plastic, glass fiber epoxy, polytetrafluoroethylene, or polyimide;

(ii) multiple arrays of electrowetting electrodes disposed on the substrate, wherein corresponding electrowetting electrodes in each array are connected to a common electrical signal, the arrays forming a phased droplet conveyor; and

(iii) a dielectric layer disposed on the substrate and patterned to cover the electrowetting electrodes;

(b) providing a droplet on the substrate; and

(c) activating electrowetting electrodes of the multiple arrays of electrowetting electrodes to cause the droplet to be transported along the phased droplet conveyor.

12. The method of claim 11 wherein the apparatus further comprises a hydrophobic layer disposed on the dielectric layer.

13. The method of claim 11, further comprising using an electrowetting electrode selector to dynamically create a sequence of array electrowetting electrode activation, thereby causing the droplet to be electrically manipulated.

14. The method of claim 11 wherein the apparatus further comprises a top plate arranged in a parallel orientation relative to the substrate and separated therefrom to define a gap between the top plate and the substrate.

15. The method of claim 14 wherein the gap comprises a liquid which is immiscible with the droplet.

16. The method of claim 11 wherein the arrays of electrowetting electrodes comprise multiple copies of a single linear array of electrowetting electrodes.

17. The method of claim 16 comprising using a common set of electrical signals to control each copy of the array.

32. The apparatus of claim 11 wherein the printed circuit board substrate comprises single boards comprising metal layers and bonded together.

33. The apparatus of claim 11 wherein the electrowetting electrodes are formed by patterning of copper foils.

34. The apparatus of claim 11 wherein the printed circuit board substrate is made from plastic.

35. The apparatus of claim 11 wherein the printed circuit board substrate is made from glass fiber epoxy.

36. The apparatus of claim 11 wherein the printed circuit board substrate is made from polytetrafluoroethylene.

37. The apparatus of claim 11 wherein the printed circuit board substrate is made from polyimide.

18. An apparatus for manipulating droplets, the apparatus comprising:

(a) a printed circuit board substrate comprising a rigid or rigid-flexible base material made from plastic, glass fiber epoxy, polytetrafluoroethylene, or polyimide;

(b) a top plate arranged in a parallel orientation relative to the substrate and separated therefrom to define a gap between the top plate and the substrate;

(c) multiple arrays of electrowetting electrodes disposed on the substrate, wherein corresponding electrowetting electrodes in each array are connected to a common electrical signal, the arrays forming a phased droplet conveyor; and

(d) a dielectric layer disposed on the substrate and patterned to cover the electrowetting electrodes.

38. The apparatus of claim 18 wherein the printed circuit board substrate comprises single boards comprising metal layers and bonded together.

39. The apparatus of claim 18 wherein the electrowetting electrodes are formed by patterning of copper foils.

40. The apparatus of claim 18 wherein the printed circuit board substrate is made from plastic.

41. The apparatus of claim 18 wherein the printed circuit board substrate is made from glass fiber epoxy.

42. The apparatus of claim 18 wherein the printed circuit board substrate is made from polytetrafluoroethylene.

43. The apparatus of claim 18 wherein the printed circuit board substrate is made from polyimide.

19. An apparatus for manipulating droplets, the apparatus comprising:

(a) a printed circuit board substrate comprising a rigid or rigid-flexible base material made from plastic, glass fiber epoxy, polytetrafluoroethylene, or polyimide;

(b) an array of electrowetting electrodes disposed on the substrate, the electrowetting electrodes forming a phased droplet conveyor; and

(c) a dielectric layer covering the electrowetting electrodes.

44. The apparatus of claim 19 wherein the printed circuit board substrate comprises single boards comprising metal layers and bonded together.

45. The apparatus of claim 19 wherein the electrowetting electrodes are formed by patterning of copper foils.

46. The apparatus of claim 19 wherein the printed circuit board substrate is made from plastic.

47. The apparatus of claim 19 wherein the printed circuit board substrate is made from glass fiber epoxy.

48. The apparatus of claim 19 wherein the printed circuit board substrate is made from polytetrafluoroethylene.

49. The apparatus of claim 19 wherein the printed circuit board substrate is made from polyimide.

50. An apparatus for manipulating droplets, the apparatus comprising:

(a) a printed circuit board substrate comprising a rigid or rigid-flexible base material consisting essentially of plastic, glass fiber epoxy, polytetrafluoroethylene, or polyimide;

(b) multiple arrays of electrowetting electrodes disposed on the substrate, wherein corresponding electrowetting electrodes in each array are connected to a common electrical signal, the arrays forming a phased droplet conveyor;

(c) a dielectric layer disposed on the substrate and patterned to cover the electrowetting electrodes; and

(d) an electrowetting electrode selector configured for dynamically creating a sequence of array electrowetting electrode activation to transport a droplet on the phased droplet conveyor.

51. The apparatus of claim 50 wherein the printed circuit board substrate comprises single boards comprising metal layers and bonded together.

52. The apparatus of claim 50 wherein the electrowetting electrodes are formed by patterning of copper foils.

53. The apparatus of claim 50 wherein the printed circuit board substrate consists essentially of plastic.

54. The apparatus of claim 50 wherein the printed circuit board substrate consists essentially of glass fiber epoxy.

55. The apparatus of claim 50 wherein the printed circuit board substrate consists essentially of polytetrafluoroethylene.

56. The apparatus of claim 50 wherein the printed circuit board substrate consists essentially of polyimide.