Method of manufacturing electronic device and electronic device

• US 8,389,328 B2
• Filed: 10/30/2009
• Issued: 03/05/2013
• Est. Priority Date: 11/06/2008
• Status: Active Grant

• Current Assignee: Sumitomo Bakelite Company Limited
• Original Assignee: Sumitomo Bakelite Company Limited
• Inventors: Meura, Toru, Nikaido, Hiroki, Maejima, Kenzou, Ishimura, Yoji
• Primary Examiner(s): Nhu, David
• Application Number:
  US13/127,770
• Publication Number:
  US 20110221075A1
• Time in Patent Office: 1,222 Days
• Field of Search: 438/106, 438/112, 438/122, 438/124, 438/126, 438/127, 438/509, 438/513, 438/612, 438/613, 257/E21.006, 257/E21.077, 257/E21.479, 257/E21.499, 257/E21.502, 257/E21.508, 257/E21.311
• US Class Current: 438/106
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 35/3613 Polymers, e.g. resins
• CPC Class Codes: B23K 35/362 Selection of compositions of fluxes B23K35/365, B23K35/368 take precedence
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13164 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75101 Chamber
• CPC Class Codes: H01L 2224/7511 High pressure chamber
• CPC Class Codes: H01L 2224/75251 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75272 Oven
• CPC Class Codes: H01L 2224/75305 : comprising protrusions
• CPC Class Codes: H01L 2224/75312 : Material
• CPC Class Codes: H01L 2224/75985 : Material
• CPC Class Codes: H01L 2224/81024 : Applying flux to the bonding area
• CPC Class Codes: H01L 2224/81075 : being inert
• CPC Class Codes: H01L 2224/81093 : Transient conditions, e.g. gas-flow
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8121 : using a reflow oven
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/81906 : Specific sequence of method steps
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/834 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2224/92125 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01059 : Praseodymium [Pr]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2203/074 : Features related to the fluid pressure
• CPC Class Codes: H05K 2203/1189 : Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 428/24116 : Oblique to direction of web
• CPC Class Codes: Y10T 428/24198 : Channel-shaped edge component [e.g., binding, etc.]
• CPC Class Codes: Y10T 428/2424 : Annular cover
• CPC Class Codes: Y10T 428/31902 : Monoethylenically unsaturated

Abstract

Provided is a method of manufacturing an electronic device having a first electronic component having a first terminal and a second electronic component having a second terminal, wherein the first electric component is electrically connected to the second electronic component by connecting the first terminal to the second terminal with solder, the method including: providing a resin layer having a flux action between the first terminal and the second terminal to obtain a laminate including the first electronic component, the second electronic component, and the resin layer, wherein a solder is provided on the first terminal or the second terminal; soldering the first terminal and the second terminal; and curing the resin layer while pressing the laminate with a pressurized fluid.

Claims

1. A method of manufacturing an electronic device comprising a first electronic component having a first terminal and a second electronic component having a second terminal, wherein said first electronic component is electrically connected to said second electronic component by connecting said first terminal to said second terminal with solder,

the method comprising:

providing a resin layer having a flux action between said first terminal and said second terminal to obtain a laminate including said first electronic component, said second electronic component, and said resin layer, wherein a solder is provided on said first terminal or said second terminal;

soldering said first terminal and said second terminal; and

curing said resin layer while pressing said laminate with a pressurized fluid.

2. The method of manufacturing an electronic device according to claim 1,

wherein, after said curing of said resin layer, said cured resin layer is again cured while said laminate is pressed by said pressurized fluid.

3. The method of manufacturing an electronic device according to claim 1,

wherein said first terminal and said second terminal are soldered while said laminate is pressed by said pressurized fluid and said resin layer is cured to perform said soldering of said first terminal and said second terminal and said curing of said resin layer.

4. The method of manufacturing an electronic device according to claim 1,

wherein, in said curing of said resin layer, said laminate is placed in a vessel and said pressurized fluid is introduced into said vessel to press said laminate.

5. The method of manufacturing an electronic device according to claim 1,

wherein said pressurized fluid is gas.

6. The method of manufacturing an electronic device according to claim 5,

wherein said pressurized fluid is air.

7. The method of manufacturing an electronic device according to claim 1,

wherein, in said curing of said resin layer, a pressure equal to or more than 0.1 MPa and equal to or less than 10 MPa is applied to said laminate by said pressurized fluid.

8. The method of manufacturing an electronic device according to claim 1,

wherein the minimum melt viscosity of said resin layer at a temperature of 100°

C. to 200°

C. is in the range of 1 Pa·

s to 10000 Pa·

s.

9. The method of manufacturing an electronic device according to claim 1,

wherein said resin layer includes a thermosetting resin.

10. The method of manufacturing an electronic device according to claim 1,

wherein said resin layer includes a resin (A) having at least one phenolic hydroxyl group and a resin (B) serving as a curing agent of the resin (A).