Semiconductor component with cell structure and method for producing the same
First Claim
1. A method for producing a plurality of semiconductor chips for semiconductor components with cell structures, comprising:
- patterning a semiconductor wafer composed of a monocrystalline semiconductor body with cell structures for MOSFETs, IGBTs or JFETs with a lateral or vertical drift path arranged between a first region of the semiconductor body for a first cell electrode and a second region of the semiconductor body for a second cell electrode, wherein the first region has a surrounding body zone with semiconductor material doped complementarily to the drift path, which body zone can be activated by a cell control electrode in interaction with a component control electrode;
arranging the cell structures in semiconductor chip positions to form a first active cell array provided below a first component electrode;
arranging the cell structures in at least one partial region of the semiconductor chip positions to form a second active cell array of the partial region, the array being provided below the component control electrode; and
providing a metallization on a first surface of the semiconductor body to form the first component electrode and the component contol electrode.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor component comprises a semiconductor body comprising a first component electrode arranged on one of the surfaces of the semiconductor body, a second component electrode arranged on one of the surfaces of the semiconductor body, and a component control electrode arranged on one of the surfaces of the semiconductor body. In this case, active semiconductor element cells are arranged in a first active cell array of the semiconductor body, the semiconductor element cells comprising a first cell electrode, a second cell electrode and a cell control electrode and also a drift path between the cell electrodes. At least the component control electrode is arranged on a partial region of the semiconductor body and a second active cell array is additionally situated in the partial region of the semiconductor body below the component control electrode.
20 Citations
12 Claims
-
1. A method for producing a plurality of semiconductor chips for semiconductor components with cell structures, comprising:
-
patterning a semiconductor wafer composed of a monocrystalline semiconductor body with cell structures for MOSFETs, IGBTs or JFETs with a lateral or vertical drift path arranged between a first region of the semiconductor body for a first cell electrode and a second region of the semiconductor body for a second cell electrode, wherein the first region has a surrounding body zone with semiconductor material doped complementarily to the drift path, which body zone can be activated by a cell control electrode in interaction with a component control electrode; arranging the cell structures in semiconductor chip positions to form a first active cell array provided below a first component electrode; arranging the cell structures in at least one partial region of the semiconductor chip positions to form a second active cell array of the partial region, the array being provided below the component control electrode; and providing a metallization on a first surface of the semiconductor body to form the first component electrode and the component contol electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
Specification