Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

• US 8,389,868 B2
• Filed: 12/31/2007
• Issued: 03/05/2013
• Est. Priority Date: 12/31/2007
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Leipold, Dirk, Hung, Chih-Ming, Evans, David W.
• Primary Examiner(s): Semenenko, Yuriy
• Application Number:
  US11/967,879
• Publication Number:
  US 20090168387A1
• Time in Patent Office: 1,891 Days
• Field of Search: 174/260, 174/520, 174/521, 361760-765, 257/787
• US Class Current: 174/260
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/4911 the connectors being bonded to at least one common bonding area, e.g. daisy chain
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 2224/92247 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/645 : Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/28 : Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits are disclosed. An example method comprises forming a substrate having a first trace and a contact, attaching an integrated circuit to the substrate over the first trace, and electrically coupling the first trace to the contact via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit.

Claims

1. A packaged integrated circuit having an inductor, comprising:

a substrate having a first trace and a second trace;

an integrated circuit attached to the substrate over the first trace and the second trace; and

an electrical conductor coupling the first trace to the second trace and extending over the integrated circuit to form the inductor in the packaged integrated circuit.

2. A packaged integrated circuit as defined in claim 1, wherein the electrical conductor comprises one or more bond wires.

3. A packaged integrated circuit as defined in claim 2, wherein more than one bond wires are coupled to one contact on the integrated circuit.

4. A packaged integrated circuit as defined in claim 1, further comprising a second electrical conductor to electrically couple the integrated circuit to the first trace.

5. A packaged integrated circuit as defined in claim 4, further comprising a third electrical conductor to electrically couple the integrated circuit to the second trace.

6. A packaged integrated circuit as defined in claim 4, further comprising a via to electrically couple the second trace to a conductive element on a surface of the packaged integrated circuit.

7. A packaged integrated circuit as defined in claim 1, wherein the electrical conductor comprises:

a first bond wire electrically coupling the first trace to the second trace; and

a second bond wire electrically coupling the first trace to the second trace.

8. A packaged integrated circuit as in claim 1, wherein the electrical conductor encompasses a first side surface, a top surface and a second side surface of the integrated circuit.

9. An electronic device, comprising:

a circuit board; and

a packaged integrated circuit attached to the circuit board, the packaged integrated circuit having a substrate having a first trace and a second trace, an integrated circuit attached to the substrate over the first trace and the second trace, and an electrical conductor coupling the first trace to the second trace and extending over the integrated circuit to form an inductor in the packaged integrated circuit.

10. An electronic device as defined in claim 9, wherein the electrical conductor comprises one or more bond wires.

11. An electronic device as defined in claim 10, wherein the one or more bond wires are coupled to one or more contacts on the integrated circuit.

12. An electronic device as defined in claim 9, wherein the electrical conductor encompasses a first side surface, a top surface and a second side surface of the integrated circuit.

13. An electronic device as defined in claim 9, wherein the electrical conductor comprises:

a trace on the integrated circuit;

a first bond wire to electrically couple the first trace to the trace on the integrated circuit; and

a second bond wire to electrically couple the trace on the integrated circuit to the second trace.

14. An electronic device as defined in claim 9, further comprising a second electrical conductor to electrically couple the integrated circuit to the first trace.

15. An electronic device as defined in claim 14, further comprising a third electrical conductor to electrically couple the second trace to the integrated circuit.

16. An electronic device as defined in claim 14, further comprising a via to electrically couple the second trace to a conductive element on a surface of the packaged integrated circuit.

17. A packaged integrated circuit, comprising:

a substrate having a first trace and a second trace;

an integrated circuit attached to the substrate over the first trace and the second trace; and

an electrical conductor electrically coupling a first contact on the first trace to a first contact on the second trace, said electrical conductor extending over the integrated circuit to form an inductor in the packaged integrated circuit.

18. A packaged integrated circuit as in claim 17, wherein a second contact on the first trace is electrically coupled to a contact on the integrated circuit.

19. A packaged integrated circuit as in claim 18, wherein a second contact on the second trace is electrically coupled to a second contact on the integrated circuit.

20. A package integrated circuit as in claim 17, further including:

a third trace on the substrate and beneath the integrated circuit;

a second electrical conductor electrically coupling a second contact on the second trace to a first contact on the third trace.

21. A packaged integrated circuit as in claim 20, wherein a second contact on the first trace is electrically coupled to a contact on the integrated circuit.

22. A packaged integrated circuit as in claim 21, wherein the second contact on the third trace is electrically coupled to a second contact on the integrated circuit.

23. A packaged integrated circuit as in claim 17, wherein the electrical conductor comprises a bond wire.

24. A packaged integrated circuit as in claim 17, wherein the electrical conductor comprises two parallel bond wires.

25. A packaged integrated circuit as in claim 17, wherein the electrical conductor comprises a first bond wire coupling the first contact on the first trace to a first contact on the integrated circuit, a second bond wire coupling the first contact on the integrated circuit to a second contact on the integrated circuit, and a third bond wire coupling the second contact on the integrated circuit to the first contact on the second trace.

26. A packaged integrated circuit as in claim 25, wherein the first and second contacts on the integrated circuit are not electrically coupled to circuitry within the integrated circuit.

27. A packaged integrated circuit as in claim 17, further comprising an insulator spaced between the electrical conductor and the integrated circuit.

28. A packaged integrated circuit as in claim 27, wherein the electrical conductor comprises a first bond wire coupling the first contact on the first trace to a first trace on a surface of the insulator opposite the integrated circuit, a second bond wire coupling the first trace on the surface of the insulator opposite the integrated circuit to the first contact on the second trace.

29. A packaged integrated circuit as in claim 17, wherein a combination of the first trace, the second trace and the electrical conductor encircles the integrated circuit.

30. A packaged integrated circuit as in claim 17, wherein the electrical conductor encompasses a first side surface, a top surface and a second side surface of the integrated circuit.