Light-emitting diode (LED) package systems

• US 8,390,009 B2
• Filed: 02/16/2010
• Issued: 03/05/2013
• Est. Priority Date: 02/16/2010
• Status: Expired due to Fees

• Current Assignee: Epistar Corporation (Ennostar, Inc.)
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Wang, Chung Yu
• Primary Examiner(s): Lee, Kyoung
• Application Number:
  US12/706,040
• Publication Number:
  US 20110198638A1
• Time in Patent Office: 1,113 Days
• Field of Search: None
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15156 Side view
• CPC Class Codes: H01L 2924/15788 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/18161 of a flip chip
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.

Claims

1. A package system comprising:

a substrate having at least three first thermally conductive structures each extending at least partially through the substrate;

at least three second thermally conductive structures each being disposed over, and thermally coupled to, a respective one of the at least three first thermally conductive structures; and

at least one light-emitting diode (LED) disposed over and thermally coupled to the at least three first and second thermally conductive structures, wherein the at least one LED includes a P-type layer and an N-type layer, the P-type layer being thermally coupled to a first subset of the at least three first and the at least three second thermally conductive structures, the N-type layer being thermally coupled to a second subset of the at least three first and at least three second thermally conductive structures, wherein at least one of the first subset and the second subset includes a number that is greater than one.

2. The package system of claim 1, wherein the substrate has a cavity for accommodating the at least one LED.

3. The package system of claim 2, where the at least one LED includes a transparent substrate and a surface of the transparent substrate is substantially level with a surface of the substrate.

4. The package system of claim 3 further comprising a lens material disposed between the substrate and the at least one LED, wherein a surface of the lens material is substantially level with the surface of the transparent substrate.

5. The package system of claim 2, wherein the at least one LED includes a transparent substrate and a surface of the transparent surface is lower than a surface of the substrate.

6. The package system of claim 5 further comprising a lens material disposed between the substrate and the at least one LED, wherein a surface of the lens material is over the surface of the transparent substrate.

7. The package system of claim 1 further comprising a polymer material around the substrate and extending from a first surface of the substrate to a second surface of the substrate.

8. The package system of claim 1, wherein the at least three first thermally conductive structures each includes a through-silicon-via (TSV) and wherein the at least three second thermally conductive structures each includes a bump structure.

9. The package system of claim 1, wherein the LED is directly coupled to each of the at least three second thermally conductive structures.

10. A package system comprising:

a first substrate having at least one through-silicon-vias (TSVs) through the first substrate;

at least one bump structure disposed over the at least one TSV;

at least one light-emitting diode (LED) disposed over the at least one bump structure, wherein the first substrate has a cavity for accommodating the LED, wherein the LED includes a transparent second substrate having a surface that is substantially level with a surface of the first substrate; and

a lens material disposed between the first substrate and the LED, wherein a surface of the lens material is substantially level with the surface of the transparent second substrate.

11. The package system of claim 10, wherein the cavity has a flat surface and at least one beveled surface and the flat surface and the at least one beveled surface form an angle between about 50°

and about 60°

.

12. The package system of claim 10 further comprising a polymer material around the substrate and extending from a first surface of the substrate to a second surface of the substrate.

16. The package system of claim 10, wherein the plurality of TSVs exceeds two.

17. The package system of claim 16, wherein each of the LEDs is thermally coupled to at least three of the plurality of TSVs.

18. The package system of claim 17, wherein each of the LEDs includes a P-type semiconductor layer and an N-type semiconductor layer, the P-type semiconductor layer being thermally and electrically coupled to a first group of the plurality of TSVs, and the N-type semiconductor layer being thermally and electrically coupled to a second group of the plurality of TSVs, wherein at least one of the first and second groups includes at least two TSVs.

19. The package system of claim 10, wherein a portion of the cavity includes a reflective surface.

13. A package system comprising:

a substrate having a cavity with a flat surface and at least one beveled surface;

three or more elongate thermally conductive components extending through the substrate;

a light-emitting diode (LED) disposed within the cavity and being thermal conductively coupled to the three or more elongate thermally conductive components, wherein the LED includes a transparent substrate;

a lens material disposed between the LED and the substrate; and

a polymer material disposed around the substrate and extending from a first surface of the substrate to a second surface of the substrate.

14. The package system of claim 13, wherein a surface of the transparent surface and a surface of the lens material are substantially level with the first surface of the substrate.

15. The package system of claim 13, wherein a surface of the transparent surface is lower than the first surface of the substrate and a surface of the lens material is over the surface of the transparent substrate.