System with recessed sensing or processing elements

• US 8,390,083 B2
• Filed: 09/04/2009
• Issued: 03/05/2013
• Est. Priority Date: 09/04/2009
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Cusack, Michael J., McGeehan, Rigan F., O'Donnell, Alan J., Griffin, Garrett A.
• Primary Examiner(s): Jackson, Jr., Jerome
• Assistant Examiner(s): Page, Dale E
• Application Number:
  US12/554,219
• Publication Number:
  US 20110057273A1
• Time in Patent Office: 1,278 Days
• Field of Search: 257/414, 257/53, 257/650, 438/48
• US Class Current: 257/414
• CPC Class Codes: B81B 3/0018 Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2224/13025 the bump connector being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/14181 On opposite sides of the body
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16146 the bump connector connecting to a via connection in the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15156 Side view
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.

Claims

1. A sensor system comprising:

a base having a frontside surface, and a backside surface comprising a plurality of recesses, and wherein the base further comprises at least one recess via from a recess to the frontside surface;

a plurality of sensors, two or more of the recesses each having at least one of the sensors; and

at least one of the two or more recesses having a port configured to permit entry of environmental media for receipt by its sensor(s).

2. A sensor system according to claim 1, further including circuitry coupled to at least two of the plurality of sensors, wherein the circuitry coordinates the activity of the at least two sensors.

3. A sensor system according to claim 1 wherein at least one recess has at least one sensor and at least one additional circuit element.

4. A sensor system according to claim 3 wherein the at least one sensor and the at least one additional circuit element are in a stacked configuration.

5. A sensor system according to claim 3 wherein the at least one sensor and the at least one additional circuit element are in a side-by-side configuration.

6. A sensor system according to claim 3 wherein the at least one sensor is encapsulated.

7. A sensor system according to claim 1, wherein the port comprises an open aperture.

8. A sensor system according to claim 1 wherein at least one recesses further comprises one of a cover, a filter that selectively permits environmental media to access the recess and a lens that focuses environmental media.

9. A sensor system according to claim 8 wherein the filter, cover or lens further comprises an interlocking feature adapted to secure the filter to the base.

10. A sensor system according to claim 1, further comprising a cover with at least one of a filter that selectively permits environmental media to access the recess and a lens that focuses environmental media.

11. A sensor system according to claim 10, wherein the cover comprises a laminated member.

12. A sensor system according to claim 11, wherein the laminated member is prefabricated prior to being coupled to the backside surface.

13. A sensor system according to claim 10 wherein the cover comprises circuitry.

14. A sensor system according to claim 1, wherein at least two of the sensors sense the same environmental media.

15. A sensor system according to claim 1, wherein at least two of the sensors sense different environmental media.

16. A sensor system according to claim 1 comprising a first sensor in a first recess, and a second sensor in a second recess, wherein the first sensor and the second sensor are configured to sense the same environmental media, and the second sensor is isolated from the environment external to the second recess.

17. A sensor system according to claim 1 wherein the base comprises silicon.

18. A sensor system according to claim 17 wherein the base further comprises integrated circuits on the frontside surface.

19. A sensor system according to claim 1 wherein the base further comprises a via all the way through the base.