Antenna, component and methods

• US 8,390,522 B2
• Filed: 08/22/2011
• Issued: 03/05/2013
• Est. Priority Date: 06/28/2004
• Status: Expired due to Fees

• Current Assignee: Cantor Fitzgerald Securities (Cantor Fitzgerald, L.P.)
• Original Assignee: Pulse Finland Oy (Yageo Corporation)
• Inventors: Sorvala, Juha, Annamaa, Petteri, Koskiniemi, Kimmo
• Primary Examiner(s): PHAN, THO GIA
• Application Number:
  US13/215,021
• Publication Number:
  US 20120068889A1
• Time in Patent Office: 561 Days
• Field of Search: 343/700, 343/702, 343/846
• US Class Current: 343/700.MS
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 13/10 Resonant slot antennas
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

An antenna component (and antenna) with a dielectric substrate and a plurality of radiating antenna elements on the surface of the substrate. In one embodiment, the plurality comprises two (2) elements, each of them covering one of the opposite heads and part of the upper surface of the device. The upper surface between the elements comprises a slot. The lower edge of one of the antenna elements is galvanically coupled to the antenna feed conductor on a circuit board, and at another point to the ground plane, while the lower edge of the opposite antenna element, or the parasitic element, is galvanically coupled only to the ground plane. The parasitic element obtains its feed through the electromagnetic coupling over the slot, and both elements resonate at the operating frequency. Omni-directionality is also achieved. Losses associated with the substrate are low due to the simple field image in the substrate.

Claims

1. A chip component, comprising:

a dielectric substrate comprising a plurality of surfaces;

a first antenna element disposed at least partially on a first of said plurality of surfaces and at least partially on a second of said plurality of surfaces, the first antenna element adapted to be electrically coupled to a feed structure at a first location;

a second antenna element disposed at least partially on a third of said plurality of surfaces, the third of said plurality of surfaces substantially opposing the first of said plurality of surfaces, and at least partially on the second of said plurality of surfaces, the second antenna element adapted to be coupled to a ground plane at least at a second location; and

an electromagnetic coupling element disposed substantially between the first antenna element and the second antenna element and configured to electromagnetically couple the second antenna element to the feed structure.

2. The chip component of claim 1, wherein the electromagnetic coupling element is disposed substantially on the second surface.

3. The chip component of claim 2, wherein the electromagnetic coupling element comprises a substantially rectangular area free from conductive material.

4. The chip component of claim 3, wherein the dielectric substrate is approximately 3 mm in width.

5. The chip component of claim 4, wherein the dielectric substrate is approximately 10 mm in length.

6. The chip component of claim 5, wherein the electromagnetic coupling element is configured to effect a resonant structure between the first antenna element, the second antenna element, the dielectric substrate, and the ground plane.

7. The chip component of claim 6, wherein a resonance of the resonant structure is formed at a frequency of approximately 1575 MHz.

8. The chip component of claim 2, wherein the first location is disposed proximate an edge of the first surface, and the second location is disposed proximate an edge of the third surface, the edges of the first and third surfaces being disposed at respective ones of two substantially opposing ends of the substrate.

9. The chip component of claim 8, wherein the first location is disposed proximate a corner of the first surface, thereby effecting at least in part a substantially omni-directional radiation pattern of the chip component within at least a first frequency range.

10. The chip component of claim 9, wherein the first antenna element is configured to be coupled to the ground plane at a third location, said third location disposed proximate the edge of the first surface and distant from said corner of said first surface.

11. The chip component of claim 8, wherein the second antenna element is further configured to couple to the ground plane at a fourth location, the fourth location disposed proximate the edge of the third surface.

12. An antenna comprising:

a dielectric substrate comprising a plurality of surfaces;

a first antenna element disposed at least partially on a first surface of said substrate and at least partially on a second surface of said substrate, the first antenna element adapted to be coupled to a feed structure at a first location and to a ground plane at a second location;

a second antenna element disposed at least partially on both a third surface and the second surface of said substrate, the third surface substantially opposing said first surface, the second antenna element configured to permit coupling to the ground plane at least at a third location; and

an electromagnetic coupling element disposed substantially between the first antenna element and the second antenna element, and configured to electromagnetically couple the second antenna element to the feed structure.

13. The antenna of claim 12, wherein the first location is disposed proximate an edge of the first surface, and the second location is disposed proximate an edge of the third surface, the edges of the first and third surfaces disposed on respective ones of two substantially opposing regions of the substrate.

14. The antenna of claim 13, wherein the first location is disposed proximate a corner of the first surface thereby effecting, at least in part, a substantially omni-directional radiation pattern of the antenna within at least a first frequency range.

15. The antenna of claim 14, wherein said first frequency range is centered at a frequency of approximately 1575 MHz.

16. The antenna of claim 13, wherein the electromagnetic coupling element is disposed substantially on the second surface.

17. The antenna of claim 16, wherein:

the second surface comprises a substantially rectangular shape; and

the electromagnetic coupling element comprises a substantially rectangular area free from conductive material and having a first dimension and a second dimension at least one of said first dimension or said second dimension being disposed parallel to said first edge.

18. The antenna of claim 17, wherein said dielectric substrate is approximately 3 mm in width.

19. The antenna of claim 18, wherein said dielectric substrate is approximately 10 mm in length.

20. The antenna of claim 19, wherein the electromagnetic coupling element is configured to effect a resonance via the first antenna element, the second antenna element, the dielectric substrate, and the ground plane.

21. The antenna of claim 13, wherein the second antenna element is further adapted to couple to the ground plane at a fourth location, the fourth location disposed proximate the edge of the third surface.

22. A radio frequency device adapted for wireless communications, the radio frequency device comprising:

a printed circuit board comprising a ground plane, a feed structure, and an antenna apparatus for enabling at least a portion of the wireless communications, the antenna apparatus comprising;

a dielectric substrate comprising a plurality of surfaces;

a first antenna element disposed at least partially on a first surface of said substrate and at least partially on a second surface of said substrate, the first antenna element galvanically coupled to a feed structure at a first location;

a second antenna element disposed at least partially on a third surface of said substrate, the third surface substantially parallel yet opposite the first surface, and at least partially on the second surface, the second antenna element coupled to the ground plane at least at a second location; and

an electromagnetic coupling element disposed at least partly between the first antenna element and the second antenna element and configured to electromagnetically couple the second antenna element to the feed structure.

23. The radio frequency device of claim 22, wherein the ground plane is arranged a first predetermined distance away from the dielectric substrate along at least a portion of a fourth surface of said dielectric substrate.

24. The radio frequency device of claim 23, wherein the fourth surface is disposed between a second edge of the first surface and a second edge of the third surface.

25. The radio frequency device of claim 22, wherein the ground plane is disposed a first predetermined distance away from the first antenna element, and the second antenna element is disposed along at least a portion of a fourth surface of said dielectric substrate.

26. The radio frequency device of claim 25, wherein the first location is disposed proximate an edge of the first surface, and the second location is disposed proximate an edge of the third surface, the edges of the first and third surfaces being located at respective ends of the substrate.

27. The radio frequency device of claim 26, wherein the first location is disposed proximate an end of the edge of the first surface.

28. The radio frequency device of claim 27, wherein disposing said first location proximate the end is configured to effect a substantially omni-directional radiation pattern of the antenna apparatus within at least a first frequency range.

29. The radio frequency device of claim 28, wherein said first frequency range is centered at a frequency of approximately 1575 MHz.

30. The radio frequency device of claim 27, wherein the first antenna element is coupled to the ground plane at a third location, said third location disposed proximate the edge of the first surface.

31. The radio frequency device of claim 25, wherein a fifth surface of said dielectric substrate is positioned proximate an edge of the ground plane, said fifth surface parallel yet opposing said fourth surface.

32. The radio frequency device of claim 25, wherein said dielectric substrate is positioned proximate an edge of the printed circuit board.

33. A radio frequency device adapted for wireless communications, the radio frequency device comprising:

a printed circuit board comprising a ground plane, a feed structure, and an antenna apparatus for enabling at least a portion of the wireless communications, the antenna apparatus comprising;

a dielectric substrate comprising a plurality of surfaces;

a first antenna element disposed at least partially on a first surface of said substrate, the first antenna element connected to the feed structure at a first location;

a second antenna element disposed at least partially on the first surface, the second antenna element coupled to the ground plane at least at a second location; and

an electromagnetic coupling element disposed at least partly between the first antenna element and the second antenna element and configured to electromagnetically couple the second antenna element to the feed structure.

34. The radio frequency device of claim 33, wherein:

the ground plane is arranged a first predetermined distance away from at least a portion of the first antenna element; and

the second antenna element is disposed along at least a portion of a second surface of said dielectric substrate, the second surface having a first edge common with that of the first surface.

35. The radio frequency device of claim 34, wherein said dielectric substrate is positioned proximate an edge of the printed circuit board.

36. The radio frequency device of claim 33, wherein the ground plane is arranged a second predetermined distance away from the dielectric substrate along at least a portion of a third surface of said dielectric substrate, the third surface opposing the second surface.

37. The radio frequency device of claim 36, wherein the second location is disposed proximate an end of the dielectric substrate.

38. The radio frequency device of claim 36, wherein the second antenna element is disposed proximate a second edge of the first surface.

39. The radio frequency device of claim 36, wherein the first and second antenna elements are disposed at least partially on the second surface.

40. The radio frequency device of claim 39, wherein the first and second antenna elements are disposed at least partially on the third surface.

41. The radio frequency device of claim 36, wherein the first location is disposed along the first edge and is spaced from a mid-point of the first edge.

42. The radio frequency device of claim 41, wherein said first location being spaced from the mid-point of the first edge effects, at least in part, a substantially omni-directional radiation pattern of the antenna apparatus within at least a first frequency range.

43. The radio frequency device of claim 42, wherein said first frequency range is centered at a frequency of approximately 1575 MHz.

44. The radio frequency device of claim 36, wherein said third surface is positioned proximate an edge of the ground plane.

45. The radio frequency device of claim 33, wherein:

the first antenna element is disposed at least partially on a second surface of said dielectric substrate, the second surface having an edge in common with the first surface; and

the second antenna element is disposed at least partially on the second surface.

46. The radio frequency device of claim 45, wherein:

the first antenna element is disposed at least partially on the third surface of said dielectric substrate, the third surface having an edge in common with the first surface, and the third surface opposite the second surface; and

the second antenna element is disposed at least partially on the third surface.

47. The radio frequency device of claim 46, wherein the ground plane is arranged a first predetermined distance away from the dielectric substrate along at least a portion of a second surface.

48. The radio frequency device of claim 47, wherein the ground plane is further arranged a second predetermined distance away from the dielectric substrate along at least a portion of the third surface of said dielectric substrate.

49. The radio frequency device of claim 48, wherein the ground plane is arranged a third predetermined distance away from the dielectric substrate along at least a portion of a fourth surface of said dielectric substrate, the fourth surface having a common edge with the first surface.

50. The radio frequency device of claim 49, wherein the ground plane is arranged a fourth predetermined distance away from the dielectric substrate along at least a portion of a fifth surface of said dielectric substrate, the fifth surface having a common edge with the first surface, and the fifth surface opposite the fourth surface.

51. The radio frequency device of claim 50, wherein the second antenna element is coupled to the ground plane at a third location.

52. The radio frequency device of claim 51, wherein the second antenna element is further coupled to the ground plane at a fourth location.

53. The radio frequency device of claim 52, wherein the second and the third locations are disposed proximate the first edge.

54. The radio frequency device of claim 53, wherein the first, second, third, and fourth locations are disposed proximate respective ones of four corners of the first surface.

55. A chip component, comprising:

a dielectric substrate comprising a plurality of surfaces;

a conductive layer disposed at least partly on a first surface of the substrate and at least partly on a second surface of the substrate, the conductive layer forming a first antenna element and a second antenna element, the first antenna element configured for electrical coupling to a feed structure at a first location, and the second antenna element configured for coupling to a ground plane at a second location; and

an electromagnetic coupling element comprising a conductor-free area, the area disposed substantially between the first antenna element and the second antenna element and configured to electromagnetically couple the second antenna element to the feed structure.

56. The chip component of claim 55, wherein the conductor-free area comprises a slot disposed substantially across the first surface of the substrate.

57. The chip component of claim 56, wherein the slot comprises a width of between 1.2 mm and 2 mm.

58. The chip component of claim 56, wherein the first antenna element is disposed proximate a first end of the dielectric substrate, and the second antenna element is disposed proximate a second end of the dielectric substrate, the second end disposed substantially opposite the first end.

59. The chip component of claim 58, wherein the second antenna element is configured for coupling to the ground plane at a third location.

60. The chip component of claim 59, wherein the second and the third locations are disposed proximate a first edge of the first surface.

61. The chip component of claim 59, wherein the first antenna element is configured for coupling to the ground plane at a fourth location.

62. The chip component of claim 61, wherein the first and the fourth locations are disposed proximate a second edge of the first surface, the second edge configured opposite the first edge.

63. The chip component of claim 61, wherein the first, the second, the third, and the fourth locations are disposed proximate respective ones of four corners of the first surface.

64. The chip component of claim 56, wherein the conductive layer is disposed on a second surface, the second surface having a common edge with the first surface, the conductive layer having a third portion and a fourth portion, the third portion connected to the first portion and the fourth portion connected to the second portion.

65. The chip component of claim 64, wherein the conductive layer is disposed on a third surface, the third surface having a common edge with the first surface, the conductive layer having a fifth portion and a sixth portion, the fifth portion connected to the first portion and the sixth portion connected to the second portion.

66. The chip component of claim 56, wherein the first location is disposed along the second and is distant to a mid-point of the second edge.

67. The chip component of claim 66, wherein said first location being disposed distant to the mid-point of the second edge effects, at least in part, a substantially omni-directional radiation pattern of the chip component within at least a first frequency range.

68. The chip component of claim 67, wherein the first frequency range is centered at a frequency of approximately 1575 MHz.

69. The chip component of claim 68, wherein the first surface is approximately 3 mm in width.

70. The chip component of claim 68, wherein the first surface is approximately 3 mm in width and 10 mm in length.

71. The chip component of claim 67, wherein the first frequency range includes a frequency of 2.4 GHz.

72. The chip component of claim 71, wherein the first surface is approximately 2 mm in width.

73. The chip component of claim 71, wherein the first surface is approximately 2 mm in width and 7 mm in length.