Internal frame optimized for stiffness and heat transfer
First Claim
1. A thermostructural component for a portable computing device comprising:
- an internal metal frame formed from at least two different metals wherein the two different metals are arranged in layers, the internal metal frame comprising;
two outer metal layers formed from a first metal and configured to add structural stiffness to the internal metal frame; and
a middle metal layer, disposed between the two outer metal layers, formed from a second metal with a thermal conductivity greater than the first metal, said middle metal layer configured to conduct heat generated by a heat generating component in the portable computing device such that it is spread out within the middle metal layer of the internal metal frame wherein the two outer metal layers and the middle metal layer are joined via a cladding process;
wherein the two outer metal layers include one or more apertures for allowing a thermal bridge to thermally link the middle layer to a surface of the heat generating component.
1 Assignment
0 Petitions
Accused Products
Abstract
A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.
-
Citations
16 Claims
-
1. A thermostructural component for a portable computing device comprising:
-
an internal metal frame formed from at least two different metals wherein the two different metals are arranged in layers, the internal metal frame comprising; two outer metal layers formed from a first metal and configured to add structural stiffness to the internal metal frame; and a middle metal layer, disposed between the two outer metal layers, formed from a second metal with a thermal conductivity greater than the first metal, said middle metal layer configured to conduct heat generated by a heat generating component in the portable computing device such that it is spread out within the middle metal layer of the internal metal frame wherein the two outer metal layers and the middle metal layer are joined via a cladding process; wherein the two outer metal layers include one or more apertures for allowing a thermal bridge to thermally link the middle layer to a surface of the heat generating component. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A portable electronic device comprising:
-
a housing with a proximate thickness; a plurality of device components arranged internally within the housing at different heights relative to the proximate thickness of the housing; an internal frame primarily disposed primarily at one height relative to the proximate thickness, coupled to the housing, formed from at least two different materials wherein the two different materials are arranged in layers, said internal frame comprising; two outer layers formed from a first material and configured to add structural stiffness of the device; and a middle layer, disposed between the two outer layers, formed from a second material with a thermal conductivity greater than the first material, said middle layer configured to conduct heat generated by the plurality of device components such that it is spread out within the middle layer of the internal frame; wherein the two outer layers include a plurality of apertures that each expose a portion of the middle layer; a plurality of thermal bridges each configured to thermally link a heat generating surface associated with one of the plurality of device components to the middle layer via one of the plurality of apertures proximate to the heating generating surface. - View Dependent Claims (7, 8, 9, 10)
-
-
11. A portable electronic device comprising:
-
a housing with a proximate thickness; a plurality of device components arranged internally within the housing at different heights relative to the proximate thickness of the housing; an internal metal frame, coupled to the housing, primarily disposed at one height relative to the proximate thickness; a display secured within the housing via attachments to the internal metal frame; wherein the internal metal frame comprises; two outer metal layers, formed from a first metal, configured to add structural stiffness to the device; and a middle metal layer, disposed between the two outer metal layers, formed from a second metal with a thermal conductivity greater than the first metal, said middle metal layer configured to conduct heat generated by at least a heat generating component such that it is spread out within the middle metal layer of the internal metal frame wherein the two outer metal layers and the middle metal layer are joined via a cladding process; a thermal bridge configured to thermally link the internal metal frame and a surface of the heat generating component. - View Dependent Claims (12, 13, 14, 15, 16)
-
Specification