Manufacturing light emitting diode (LED) packages

• US 8,394,675 B2
• Filed: 05/26/2011
• Issued: 03/12/2013
• Est. Priority Date: 11/02/2010
• Status: Expired due to Fees

• Current Assignee: Carsem (M) SDN BHD (Hong Leong Company (Malaysia) Bhd.)
• Original Assignee: Carsem (M) SDN BHD (Hong Leong Company (Malaysia) Bhd.)
• Inventors: Wai, Yong Lam, Meng, Chan Boon, Keat, Phang Hon
• Primary Examiner(s): Chambliss, Alonzo
• Application Number:
  US13/116,986
• Publication Number:
  US 20120107974A1
• Time in Patent Office: 656 Days
• Field of Search: None
• US Class Current: 438/111
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83862 Heat curing
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1715 : Shape
• CPC Class Codes: H01L 2924/20104 : Temperature range 100 C=<T<150 C, 373.15 K =< T < 423.15K
• CPC Class Codes: H01L 2924/20105 : Temperature range 150 C=<T<200 C, 423.15 K =< T < 473.15K
• CPC Class Codes: H01L 2933/005 : relating to encapsulations
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of manufacturing an LED package includes mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring. The LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. Each of the die pads includes a planar chip attach surface. An LED chip is attached to the planar chip attach surface of each of the die pads. An encapsulant material is applied overlaying the LED chips and at least a part of the LPF/S. Each die pad and corresponding leads are separated from the LPF/S to form individual LED packages. The steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring.

Claims

1. A method of manufacturing light emitting diode (LED) packages, the method comprising:

mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring, wherein the LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern, each of the die pads including a planar chip attach surface;

attaching an LED chip to the planar chip attach surface of each of the die pads;

applying an encapsulant material overlaying the LED chips and at least a part of the LPF/S;

separating each die pads pad and corresponding leads from the LPF/S to form LED packages, wherein steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring; and

for each LED package, attaching a heat slug to a bottom exposed surface of the die pad, the heat slug configured to increase heat dissipation from the LED chip when mounted on a circuit board.

2. The method set forth in claim 1, wherein applying the encapsulant further comprises;

providing an array mold cavity;

dispensing the encapsulant material into the array mold cavity;

engaging the array mold cavity including the encapsulant material with the LPF/S including the LED chips; and

curing the encapsulant material.

3. The method set forth in claim 1, wherein the LPF/S is mounted to the ring using an adhesive tape.

4. The method set forth in claim 1, wherein the LPF/S and ring are transported using a handler that provides movement in forward/backward and lateral directions during the steps of attaching the LED chips, applying the encapsulant material, and separating the die pads.

5. The method set forth in claim 1, wherein each of the die pads include a recessed cavity in a top surface of the die pad, and the planar chip attach surface of each of the die pads extends along a bottom of the recessed cavity.

6. The method set forth in claim 5, wherein sidewalls of the recessed cavity extend from the planar chip attach surface to the top surface of each die pad and form an obtuse angle at a junction where the sidewalls intersect the planar chip attach surface.

7. The method set forth in claim 5, further comprising inserting a light reflector within the recessed cavity.

8. A method of manufacturing light emitting diode (LED) packages, the method comprising:

mounting a large panel frame/substrate (LPF/S) to a ring using an adhesive tape, wherein the LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern, each of the die pads including a planar chip attach surface;

attaching an LED chip to the planar chip attach surface of each of the die pads;

applying an encapsulant material overlaying the LED chips and at least a part of the LPF/S;

separating each die pads pad and corresponding leads from the LPF/S to form LED packages, wherein steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring; and

for each LED package, attaching a heat slug to a bottom exposed surface of the die pad, the heat slug configured to increase heat dissipation from the LED chip when mounted on a circuit board.

9. The method of claim 8 wherein applying the encapsulant further comprises:

providing an array mold cavity;

dispensing the encapsulant material into the array mold cavity;

engaging the array mold cavity including the encapsulant material with the LPF/S including the LED chips; and

curing the encapsulant material.

10. The method of claim 8 wherein the adhesive tape is an adhesive high temperature tape.

11. The method of claim 8 wherein the LPF/S and ring are transported using a handler that provides movement in forward/backward and lateral directions during the steps of attaching the LED chips, applying the encapsulant material, and separating the die pads.

12. The method of claim 8 wherein each of the die pads include a recessed cavity in a top surface of the die pad, and the planar chip attach surface of each of the die pads extends along a bottom of the recessed cavity.

13. The method of claim 12 wherein sidewalls of the recessed cavity extend from the planar chip attach surface to the top surface of each die pad and form an obtuse angle at a junction where the sidewalls intersect the planar chip attach surface.

14. The method of claim 12 further comprising inserting a light reflector within the recessed cavity.