Printable semiconductor structures and related methods of making and assembling
First Claim
1. A method for registered assembly of a plurality of printable semiconductor elements on a receiving surface of a substrate, said method comprising the steps of:
- providing a plurality of printable semiconductor structures having preselected spatial orientations relative to each other;
wherein each of said printable semiconductor structures comprises a printable semiconductor element, and a bridge element connected to said printable semiconductor element and connected to a mother wafer, wherein each of said printable semiconductor elements and said bridge elements are at least partially undercut from said mother wafer;
contacting said printable semiconductor elements with a transfer device having a contact surface, wherein contact between said contact surface and said printable semiconductor elements binds at least a portion of said printable semiconductor elements to said contact surface of said transfer device;
moving said transfer device in a manner resulting in the fracture of at least a portion of said bridge elements, thereby providing for registered transfer of at least a portion of said printable semiconductor elements from said mother wafer to said transfer device, thereby forming said contact surface having at least a portion of said printable semiconductor elements disposed thereon;
contacting said receiving surface of said substrate with said printable semiconductor elements disposed on said contact surface; and
separating said contact surface of said transfer device and said printable semiconductor elements, wherein said printable semiconductor elements are transferred onto said receiving surface, thereby providing for registered assembly of said plurality of printable semiconductor elements on said receiving surface of said substrate.
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Abstract
The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
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Citations
24 Claims
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1. A method for registered assembly of a plurality of printable semiconductor elements on a receiving surface of a substrate, said method comprising the steps of:
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providing a plurality of printable semiconductor structures having preselected spatial orientations relative to each other;
wherein each of said printable semiconductor structures comprises a printable semiconductor element, and a bridge element connected to said printable semiconductor element and connected to a mother wafer, wherein each of said printable semiconductor elements and said bridge elements are at least partially undercut from said mother wafer;contacting said printable semiconductor elements with a transfer device having a contact surface, wherein contact between said contact surface and said printable semiconductor elements binds at least a portion of said printable semiconductor elements to said contact surface of said transfer device; moving said transfer device in a manner resulting in the fracture of at least a portion of said bridge elements, thereby providing for registered transfer of at least a portion of said printable semiconductor elements from said mother wafer to said transfer device, thereby forming said contact surface having at least a portion of said printable semiconductor elements disposed thereon; contacting said receiving surface of said substrate with said printable semiconductor elements disposed on said contact surface; and separating said contact surface of said transfer device and said printable semiconductor elements, wherein said printable semiconductor elements are transferred onto said receiving surface, thereby providing for registered assembly of said plurality of printable semiconductor elements on said receiving surface of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification