Light emitting device package
First Claim
1. A light emitting device package comprising:
- a light emitting device chip comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and the second conductive type semiconductor layers;
at least two wires attached to and projecting from an upper surface of the light emitting device chip; and
an encapsulating material on the light emitting device chip, wherein the encapsulating material comprises a phosphor, and wherein the height of an upper surface of the encapsulating material equal to or less than the height of the at least two wires,wherein the encapsulating material comprising the phosphor is disposed only between the at least two wires,wherein at least two wires comprise at least one real wire and at least one dummy wire, andwherein the real wire is electrically connected to the light emitting device chip and the dummy wire is not electrically connected to the light emitting device chip.
2 Assignments
0 Petitions
Accused Products
Abstract
Provided are a light emitting device package and a lighting system. The light emitting device package includes a light emitting device chip, at least one wire, and an encapsulating material. The light emitting device chip includes a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and second conductive type semiconductor layers. The wire is on the light emitting device chip. The encapsulating material is on the light emitting device chip out of the wire, and includes a phosphor. The wire is perpendicular to an upper surface of the light emitting device chip, at least up to a height of the encapsulating material.
63 Citations
8 Claims
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1. A light emitting device package comprising:
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a light emitting device chip comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and the second conductive type semiconductor layers; at least two wires attached to and projecting from an upper surface of the light emitting device chip; and an encapsulating material on the light emitting device chip, wherein the encapsulating material comprises a phosphor, and wherein the height of an upper surface of the encapsulating material equal to or less than the height of the at least two wires, wherein the encapsulating material comprising the phosphor is disposed only between the at least two wires, wherein at least two wires comprise at least one real wire and at least one dummy wire, and wherein the real wire is electrically connected to the light emitting device chip and the dummy wire is not electrically connected to the light emitting device chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification