Packaging for low-cost, high-performance microwave and millimeter wave modules

• US 8,395,256 B2
• Filed: 02/02/2007
• Issued: 03/12/2013
• Est. Priority Date: 02/02/2007
• Status: Active Grant

• Current Assignee: Harris Stratex Networks Operating Corporation (Aviat Networks Incorporated)
• Original Assignee: Harris Stratex Networks Operating Corporation (Aviat Networks Incorporated)
• Inventors: Boesch, Ronald D., Nealis, Edwin John, Nicolae, Costel
• Primary Examiner(s): Im, Junghwa M
• Application Number:
  US11/670,952
• Publication Number:
  US 20080188098A1
• Time in Patent Office: 2,230 Days
• Field of Search: 257/728, 257/678, 257/684, 257/734, 257/E21.499
• US Class Current: 257/728
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 13/04 Mounting of components , e.g. of leadless components
• CPC Class Codes: H05K 9/0056 specially adapted for microwave applications
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

Microwave or millimeter wave system packaging having a system with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.

Claims

1. A system comprising:

a wireless transceiver printed circuit board (PCB) enabled to transmit and receive a wireless signal;

a baseplate having a microwave or millimeter wave component attached thereto;

a substantially planar transition board having a first connector attached to a first side of the transition board and operatively connected to the component, and a second connector attached to a second side of the transition board and operatively connected to the component through the transition board, wherein the first side of the transition board and the second side of the transition board are not the same side; and

a cover;

wherein the cover and the baseplate form a cavity containing the transition board and the component;

wherein the wireless transceiver PCB is disposed outside the cavity and operatively connected to a third connector disposed outside of the cavity; and

wherein the second connector is mated with the third connector and the second connector is operatively connected to the wireless transceiver PCB through the third connector, thereby operatively connecting the component to the wireless transceiver PCB.

2. The system of claim 1 wherein the component is selected from the group consisting of:

monolithic microwave integrated circuit chips, field effect transistors, transistors, diodes, mixers, multipliers, modulators, amplifiers, attenuators, switches, circulators, isolators, filters, couplers, detectors, splitters, combiners, substrates, or combinations thereof.

3. The system of claim 1 wherein connection between the second and third connectors is a blind mate connection.

4. The system of claim 1 wherein the board is removably attached to the baseplate.

5. The system of claim 1 wherein connection between the first connector and the component is a direct connection without a wire or cable.

6. The system of claim 1 wherein power and signal connectors are not attached to either the baseplate or the cover.

7. The system of claim 1 wherein the baseplate and the cover do not provide electromagnetic interference protection.

8. The system of claim 1 wherein the transition board further includes a fourth connector attached to another side of the transition board, the fourth connector operatively connected to the component through the transition board.

9. The system of claim 1 wherein the transition board further includes a fourth connector attached to another side of the transition board, the fourth connector directly connected to the component.

10. An assembly comprising:

a wireless transceiver printed circuit board (PCB) enabled to transmit and receive a wireless signal;

a structure having an indentation for accepting a module, the indentation bounded on one side by a printed circuit board operatively connected to the wireless transceiver PCB;

the module comprising;

a baseplate having a microwave or millimeter wave component attached thereto;

a substantially planar transition board having a first connector attached to a first side of the transition board and operatively connected to the component, and a second connector attached to a second side of the transition board and operatively connected to the component through the transition board, wherein the first side of the transition board and the second side of the transition board are not the same side; and

a first cover, wherein the first cover and the baseplate form a cavity containing the transition board and the component; and

a second cover,

wherein the module is disposed within the indentation such that the second connector is mated with a third connector disposed outside the cavity and the second connector is operatively connected to the wireless transceiver PCB through the third connector, thereby operatively connecting the component to the wireless transceiver PCB, and

wherein the second cover and the structure enclose the module.

11. The assembly of claim 10 wherein the component is selected from the group consisting of:

monolithic microwave integrated circuit chips, field, effect transistors, transistors, diodes, mixers, multipliers, modulators, amplifiers, attenuators, switches, circulators, isolators, filters, couplers, detectors, splitters, combiners, substrates, or combinations thereof.

12. The assembly of claim 10 wherein connection between the second connector and the printed circuit board is a blind mate connection.

13. The assembly of claim 10 wherein the transition board is removably attached to the baseplate.

14. The assembly of claim 10 wherein the second cover and the structure enclose the module so as to provide electromagnetic interference protection.

15. The assembly of claim 10 wherein connection between the first connector and the component is a direct connection without a wire or cable.

16. The assembly of claim 10 wherein power and signal connectors are not attached to either the baseplate or the first cover.

17. The assembly of claim 10 wherein the baseplate and the first cover do not provide electromagnetic interference protection.

18. The assembly of claim 10 wherein the structure provides a second structure to remove heat from the module.

19. The assembly of claim 18 wherein the second structure is selected from the group consisting of:

heat fins, fans, heat pipes.

20. The assembly of claim 10 wherein the transition board further includes a fourth connector attached to another side of the transition board, the fourth connector operatively connected to the component through the transition board.

21. The assembly of claim 10 wherein the transition board further includes a fourth connector attached to another side of the transition board, the fourth connector directly connected to the component.

22. The assembly of claim 10 wherein the second cover and the indentation provide electromagnetic interference protection.

23. The assembly of claim 10 further comprising a gasket which provides electromagnetic interference protection.

24. A communication system operating in a predetermined frequency range comprising:

a wireless transceiver printed circuit board (PCB) enabled to transmit and receive a wireless signal;

a plurality of assemblies, at least one assembly comprising;

a structure having an indentation for accepting a module, the indentation bounded on one side by a printed circuit board operatively connected to the wireless transceiver PCB;

the module comprising;

a baseplate having a microwave or millimeter wave component attached thereto;

a substantially planar transition board having a first connector attached to a first side of the transition board and operatively connected to the component, and a second connector attached to a second side of the transition board and operatively connected to the component through the transition board, wherein the first side of the transition board and the second side of the transition board are not the same side; and

a first cover, wherein the first cover and the baseplate form a cavity containing the transition board and the component; and

a second cover,

wherein the module is disposed within the indentation such that the second connector is mated with a third connector disposed outside the cavity and the second connector is operatively connected to the wireless transceiver PCB through the third connector, thereby operatively connecting the component to the wireless transceiver PCB, and

wherein the second cover and the structure enclose the module.

25. The system of claim 24 wherein the component is selected from the group consisting of:

monolithic microwave integrated circuit chips, field effect transistors, transistors, diodes, mixers, multipliers, modulators, amplifiers, attenuators, switches, circulators, isolators, filters, couplers, detectors, splitters, combiners, substrates, or combinations thereof.

26. The system of claim 24 wherein connection between the second connector and the printed circuit board is a blind mate connection.

27. The system of claim 24 wherein the transition board is removably attached to the baseplate.

28. The system of claim 24 wherein the second cover and the structure enclose the module so as to provide electromagnetic interference protection.

29. The system of claim 24 wherein connection between the first connector and the component is a direct connection without a wire or cable.

30. The system of claim 24 wherein power and signal connectors are not attached to either the baseplate or the first cover.

31. The system of claim 24 wherein the baseplate and the first cover do not provide electromagnetic interference protection.

32. The system of claim 24 wherein the structure provides a second structure to remove heat from the module.

33. The system of claim 32 wherein the second structure is selected from the group consisting of:

heat fins, fans, heat pipes.

34. The system of claim 24 wherein the transition board further includes a fourth connector attached to another side of the transition board, the fourth connector operatively connected to the component through the transition board.

35. The system of claim 24 wherein the transition board further includes a fourth connector attached to another side of the transition board, the fourth connector directly connected to the component.

36. The system of claim 24 wherein the second cover and the indentation provide electromagnetic interference protection.

37. The system of claim 24 wherein the structure further comprises a gasket which provides electromagnetic interference protection.