Lamp and lighting equipment with thermally conductive substrate and body

• US 8,395,304 B2
• Filed: 09/23/2010
• Issued: 03/12/2013
• Est. Priority Date: 09/25/2009
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Inventors: Hisayasu, Takeshi, Morikawa, Kazuto, Shibahara, Yusuke
• Primary Examiner(s): Green, Tracie Y
• Application Number:
  US12/888,921
• Publication Number:
  US 20110074271A1
• Time in Patent Office: 901 Days
• Field of Search: 313/46, 362/294
• US Class Current: 313/46
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 19/004 by deformation of parts or snap action mountings, e.g. using clips
• CPC Class Codes: F21V 19/0055 by screwing
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

In one embodiment, a lamp includes a thermal conductive hollow base body having a concave container portion, an opening portion formed at one end portion so as to communicate with the container portion and a substrate support portion formed at a peripheral portion of the opening portion. A substrate is formed of one of a thermal conductive metal plate and a thermal conductive insulating plate and including a semiconductor lighting element mounted on one surface. A peripheral portion of the other surface of the substrate is fixed to the substrate support portion so as to cover the opening portion in a thermally conductive state therebetween. A power supply device is accommodated in the container portion of the base body to light on the semiconductor lighting element. A base is provided at the other end portion side of the base body and electrically connected with the power supply device.

Claims

1. A lamp, comprising:

a thermally conductive hollow base body having a first end portion and a second end portion, including a concave container portion, an opening portion formed at the first end portion so as to communicate with the container portion and a substrate support portion formed at the opening portion;

a substrate formed of a thermally conductive metal plate having a first surface and a second surface opposing to the first surface, and including a semiconductor lighting element mounted on the first surface, a peripheral portion of the second surface of the substrate being fixed to the substrate support portion of the base body;

a power supply device accommodated in the container portion of the base body to light on the semiconductor lighting element; and

a base provided at the second end portion side of the base body and electrically connected with the power supply device;

wherein a metal portion of the thermally conductive metal plate thermally contacts with the substrate support portion.

2. The lamp according to claim 1, wherein the substrate is formed of a COB (Chip On Board) module having the semiconductor lighting element on the first surface.

3. The lamp according to claim 1, wherein the substrate is formed of a SMD (Surface Mount Device) module having the semiconductor lighting element on the first surface.

4. The lamp according to claim 1, further comprising an insulating case fitted to the container portion of the base body and having an opening portion.

5. The lamp according to claim 4, wherein the substrate support portion is arranged in a substantially same plane as the opening portion of the insulating case.

6. The lamp according to claim 4, wherein the power supply device includes a circuit board accommodated in the insulating case.

7. The lamp according to claim 1, wherein the lamp is compatible to a mini krypton filament bulb.

8. The lamp according to claim 1, further comprising a cover element provided at the first end portion of the base body to cover the substrate, wherein the cover element, the base and the base provided at the second end portion side of the base body form a hole appearance of a lamp approximated to a silhouette of a filament lamp (PS type).

9. The lamp according to claim 8, the base includes a shell portion and an eyelet portion.

19. A lamp according to claim 1, wherein:

the substrate support portion is formed at peripheral portion of the opening portion; and

the peripheral portion of the second surface of the substrate is fixed to the substrate support portion of the base body so as to cover the opening portion in a thermally conductive state therebetween.

10. A lamp, comprising:

a thermally conductive hollow base body formed in a circular truncated cone shape having a first end portion and a second end portion smaller than the first end portion, and including a concave container portion having an opening portion formed at the first end portion so as to communicate with the container portion and a substrate support portion formed at the opening portion;

a substrate formed of a thermally conductive metal plate having a first surface and a second surface opposing to the first surface, and including a semiconductor lighting element mounted on the first surface, a peripheral portion of the second surface of the substrate being fixed to the substrate support portion;

an insulating case fitted to the container portion;

a power supply device accommodated in the insulating case to light on the semiconductor lighting element; and

a base provided at the second end portion side of the base body and electrically connected with the power supply device;

wherein a metal portion of the thermally conductive metal plate thermally contacts with the substrate support portion.

11. The lamp according to claim 10, wherein the substrate is formed of a polygonal shape, and the substrate is arranged so as to have a space between the base body and the substrate.

12. The lamp according to claim 11, wherein an output wire pulled out from the power supply device extends to the first surface of the substrate and is connected with the light emitting element through the space.

13. The lamp according to claim 10, further comprising a cover element provided at the first end portion of the base body to cover the substrate. wherein the cover element, the base body and the base provided at the second end portion side of the base body form a whole appearance of a lamp approximated to a silhouette of a filament lamp (PS type).

14. The lamp according to claim 13, wherein the lamp is compatible to a mini krypton filament bulb.

15. A lighting equipment having a lamp and a socket, the lamp comprising:

a thermally conductive hollow base body having a first end portion and a second end portion, including a concave container portion, an opening portion formed at the first end portion so as to communicate with the container portion and a substrate support portion formed at the opening portion;

a substrate formed of a thermally conductive metal plate having a first surface and a second surface, and including a semiconductor lighting element mounted on the first surface, a peripheral portion of the second surface of the substrate being fixed to the substrate support portion;

a power supply device accommodated in the container portion of the base body to light on the semiconductor lighting element; and

a base provided at the second end portion side of the base body and electrically connected with the power supply device;

wherein a metal portion of the thermally conductive metal plate thermally contacts with the substrate support portion.

16. The lighting equipment according to claim 15, wherein the substrate is formed of a COB (Chip On Board) module having the semiconductor lighting element on the first surface.

17. The lighting equipment according to claim 15, wherein the substrate is formed of a SMD (Surface Mount Device) module having the semiconductor lighting element on the first surface.

18. The lighting equipment according to claim 15, wherein the hollow base body is formed so that the first end portion is larger than the second end portion to form a circular truncated cone outer shape.

20. A lamp, comprising:

a thermally conductive hollow base body having a first end portion and a second end portion, including a concave container portion, an opening portion formed at the first end portion so as to communicate with the container portion and a substrate support portion formed at the opening portion;

a substrate formed of a thermally conductive insulating plate having a first surface and a second surface opposing to the first surface, and including a semiconductor lighting element mounted on the first surface, a peripheral portion of the second surface of the substrate being fixed to the substrate support portion of the base body;

a power supply device accommodated in the container portion of the base body to light on the semiconductor lighting element; and

a base provided at the second end portion side of the base body and electrically connected with the power supply device;

wherein a thermally conductive portion of the thermal conductive Insulating plate thermally contacts with the substrate support portion.

21. A lamp according to claim 20, wherein the substrate is formed of a thermally conductive ceramics substrate and the ceramics portion contacts with the substrate support portion.

22. A lamp according to claim 21, further comprising a fixing element which fixes the substrate to the substrate support portion.

23. A lamp according to claim 22, further comprising a stabilizer which presses a side of the substrate formed of the thermal conductive insulating plate.