Pattern drawing method and pattern drawing apparatus

• US 8,398,227 B2
• Filed: 12/05/2008
• Issued: 03/19/2013
• Est. Priority Date: 12/06/2007
• Status: Active Grant

• Current Assignee: National Institute of Advanced Industrial Science and Technology (Government of Japan)
• Original Assignee: National Institute of Advanced Industrial Science and Technology (Government of Japan)
• Inventors: Akedo, Jun, Endo, Akito
• Primary Examiner(s): RAHLL, JERRY T
• Application Number:
  US12/745,295
• Publication Number:
  US 20100302319A1
• Time in Patent Office: 1,565 Days
• Field of Search: None
• US Class Current: 347/101
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 2203/111 Preheating, e.g. before soldering
• CPC Class Codes: H05K 3/1208 Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns providing shape patterns H05K3/1258; adhesion treatments H05K3/38
• CPC Class Codes: H05K 3/125 by ink-jet printing

Abstract

Disclosed herein is a fine and thick wiring drawn at high speed in such a manner that a region on the substrate, on which region the liquid droplet is scheduled to impact, is heated beforehand, and that immediately after the impact of the liquid droplet on the substrate, the liquid droplet is promptly solidified so as thereby to suppress the spread of the liquid droplet due to the wettability of the liquid droplet to the substrate, and also to suppress the clogging of the nozzle due to the heating of the substrate. Thereby, even in the case where a liquid droplet having a larger volume than before is used, high-speed drawing of a thick and fine wiring having a line width approximately equal to the liquid droplet size is realized independently of the substrate material.

Claims

1. A pattern drawing method for forming a pattern comprising:

preheating an impact scheduled region on a substrate on which the pattern is to be formed by using a heating apparatus that is arranged at a position located on an upstream side of an ink jet head which is moved relative to the substrate and which is separated from the substrate;

forming liquid droplets, by an inkjet method, of a raw material comprising ink and metallic particles, and making the droplets impact on the substrate;

wherein the heating apparatus is arranged at the position located on the upstream side of the ink jet head so that the substrate is preheated before the droplets are impacted on the substrate, and a distance between a distance between an inkjet liquid droplet impact scheduled position on the substrate and a center position on the substrate, which center position is heated by heating apparatus, is set in a range of 0.5 mm to 50 mm, and a surface temperature at the inkjet liquid droplet impact scheduled position is in a range of 50 to 200°

C.

2. The pattern drawing method according to claim 1, wherein the preheating the impact scheduled region on the substrate comprises irradiating a laser or an infrared ray onto the impact scheduled region.

3. The pattern drawing method according to claim 1, further comprising:

measuring with a substrate temperature measuring process a temperature of the impact scheduled region on the substrate; and

controlling with a preheating control process a moving speed of the substrate, a discharge cycle of the liquid droplets, and the heating of the impact scheduled region on the basis of the substrate temperature measured in the substrate temperature measuring process.

4. The pattern drawing method according to claim 1, wherein the metallic particles are in a metal alkoxide solution.

5. A wiring pattern formed by the pattern drawing method of claim 1, wherein the wiring pattern has an aspect ratio of 0.1 or more, the aspect ratio a ratio of wiring thickness to line width of the wiring pattern.

6. A wiring pattern formed by the pattern drawing method of claim 1, wherein an angle of a side wall of the wiring pattern is an acute angle of 17 degrees or more.

7. The pattern drawing method according to claim 1, wherein the pattern is a wiring pattern or a functional film pattern.

8. A pattern drawing apparatus for forming, by an inkjet method, a wiring pattern or a functional film pattern on a substrate with ink including metal fine particles or a metal alkoxide solution formed into liquid droplets that impact the substrate, the pattern drawing apparatus comprising:

substrate heating means for heating an impact scheduled region on the substrate where the liquid droplets will impact;

moving means for moving the substrate;

substrate temperature measuring means for measuring a substrate temperature in the impact scheduled region on the substrate; and

preheating control means for controlling, on the basis of the substrate temperature, a moving speed of the moving means, a discharge cycle of the liquid droplets, and the heating of the impact scheduled region, wherein the substrate heating means is arranged at a position that is located on an upstream side of an ink jet head which is moved relative to the substrate and which is separated from the substrate, a distance between the impact scheduled region on the substrate and a center position on the substrate is set in a range of 0.5 mm to 50 mm, and a surface temperature at the impact scheduled region is in a range of 50 to 200°

C.

9. pattern drawing method for forming a pattern comprising:

arranging a heating apparatus at a position that is located on an upstream side of an ink jet head to a substrate moving direction, and forming an impact scheduled region of the substrate by heating using the heating apparatus; and

forming liquid droplets, by an inkjet method, of a raw material comprising ink and metallic particles, and making the liquid droplets impact on the substrate;

wherein the impact scheduled region is a region of the substrate that is preheated before the liquid droplets from the ink jet head are impacted on the substrate, and a distance between an ink jet liquid droplet impact scheduled position on the substrate and a center position on the substrate, which center position is heated by the heating apparatus, is set in the range of 0.5 mm to 50 mm and the surface temperature at a liquid droplet impact scheduled region is in the range of 50 to 200°

C.