Method of manufacturing organic light emitting device and vapor deposition system

• US 8,398,774 B2
• Filed: 12/13/2006
• Issued: 03/19/2013
• Est. Priority Date: 12/14/2005
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Tokunaga, Yuzo, Mashimo, Seiji, Yoshikawa, Toshiaki, Fukuda, Naoto, Otsuka, Manabu
• Primary Examiner(s): CHEN, KEATH T
• Application Number:
  US11/610,022
• Publication Number:
  US 20070134405A1
• Time in Patent Office: 2,288 Days
• Field of Search: 118/726
• US Class Current: 118/726
• CPC Class Codes: C23C 14/24 Vacuum evaporation
• CPC Class Codes: C23C 14/243 Crucibles for source material C23C14/28, C23C14/30 take precedence
• CPC Class Codes: H10K 50/171 Electron injection layers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/164 using vacuum deposition
• CPC Class Codes: H10K 71/30 Doping active layers, e.g. electron transporting layers
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour

Abstract

Provided is a method of manufacturing an organic light emitting device including the step of forming an electron injection layer. The step of forming the electron injection layer includes the steps of: vaporizing in a container a dopant material as a raw material of a dopant; causing the vaporized dopant material to pass a heated medium between the container and the substrate; and forming the organic compound into the electron injection layer. According to the method the organic light emitting device which has high electron injection efficiency and can be driven at a low voltage can be obtained.

Claims

1. A vapor deposition system comprising:

a container for containing a vapor deposition material therein, the container having an opening;

a heating unit for vaporizing the vapor deposition material contained in the container;

a medium provided in the container such that the vaporized vapor deposition material is in contact with the medium; and

a shielding member for shielding heat generated by the medium,

wherein the medium can be heated to 200°

C. or higher and is composed of a metal, which decomposes the vapor deposition material by a chemical reaction,

wherein the shielding member is provided at the opening of the container and the medium is provided in a space defined by the shielding member and the container, and the shielding member has an opening; and

wherein another shielding member having an opening is provided between the vapor deposition material and the medium, and the other shielding member is disposed so as to be spaced apart from the vapor deposition material.

2. The vapor deposition system according to claim 1, wherein the shape of the medium is a coiled filament.