Oxide semiconductor transistors and methods of manufacturing the same
First Claim
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1. A transistor, comprising:
- an oxide semiconductor layer including a source region, a drain region and a channel region, the channel region between the source and drain regions;
a gate electrode on the channel region;
a gate insulating layer between the channel region and the gate electrode, the gate insulating layer on the source region, the drain region, and the channel region; and
insulating spacers on the gate insulating layer and on at least one surface of the gate electrode, the gate insulating layer being wider than a combined width of the gate electrode and the insulating spacers.
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Abstract
Transistors and methods of manufacturing the same. A transistor may be an oxide thin film transistor (TFT) with a self-aligned top gate structure. The transistor may include a gate insulating layer between a channel region and a gate electrode that extends from two sides of the gate electrode. The gate insulating layer may cover at least a portion of source and drain regions.
37 Citations
20 Claims
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1. A transistor, comprising:
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an oxide semiconductor layer including a source region, a drain region and a channel region, the channel region between the source and drain regions; a gate electrode on the channel region; a gate insulating layer between the channel region and the gate electrode, the gate insulating layer on the source region, the drain region, and the channel region; and insulating spacers on the gate insulating layer and on at least one surface of the gate electrode, the gate insulating layer being wider than a combined width of the gate electrode and the insulating spacers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A transistor, comprising:
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an oxide semiconductor layer including a source region, a drain region and a channel region, the channel region between the source and drain regions; a gate electrode on the channel region; a gate insulating layer between the channel region and the gate electrode, the gate insulating layer on the source region, the drain region, and the channel region; a first electrode layer contacting the source region; and a second electrode layer contacting the drain region, the first and second electrodes contacting at least two sides of the gate insulating layer. - View Dependent Claims (11)
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12. A method of manufacturing a transistor, the method comprising:
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forming an oxide semiconductor layer including a channel region; forming a gate insulating layer on the oxide semiconductor layer; forming a conductive layer on the gate insulating layer; patterning the conductive layer to form a gate electrode corresponding to the channel region and to expose the gate insulating layer adjacent to the gate electrode; forming source and drain regions in the oxide semiconductor layer adjacent to the gate electrode; forming insulating spacers on at least one side surface of the gate electrode; and etching the gate insulating layer by using the gate electrode and the insulating spacers as an etch mask. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A method of manufacturing a transistor, the method comprising:
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forming an oxide semiconductor layer including a channel region; forming a gate insulating layer on the oxide semiconductor layer; forming a conductive layer on the gate insulating layer; patterning the conductive layer to form a gate electrode corresponding to the channel region and to expose the gate insulating layer adjacent to the gate electrode; forming source and drain regions in the oxide semiconductor layer adjacent to the gate electrode; and forming first and second electrode layers respectively contacting the source and drain regions, the first and second electrodes contacting at least two sides of the gate insulating layer. - View Dependent Claims (20)
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Specification