Thermal fuse resistor, manufacturing method thereof, and installation method thereof

• US 8,400,253 B2
• Filed: 04/21/2010
• Issued: 03/19/2013
• Est. Priority Date: 04/21/2009
• Status: Active Grant

• Current Assignee: Smart Electronics, Inc.
• Original Assignee: Smart Electronics, Inc.
• Inventors: Kang, Doo Won, Ahn, Gyu Jin, Kim, Sung Kwang, Lee, Kyung Mi, Jung, Jong II
• Primary Examiner(s): Vortman, Anatoly
• Application Number:
  US13/265,741
• Publication Number:
  US 20120032774A1
• Time in Patent Office: 1,063 Days
• Field of Search: 337/4, 337/6, 337/20, 337/35, 337/401, 337/186, 337/187, 337/414, 337/112, 337/327, 337/380, 337/398, 337/182, 337/183, 361/837, 298/25
• US Class Current: 337/186
• CPC Class Codes: H01H 2085/0412 specially adapted for being mounted on a printed circuit board
• CPC Class Codes: H01H 69/02 Manufacture of fuses
• CPC Class Codes: H01H 85/048 Fuse resistors
• CPC Class Codes: H01H 85/165 Casings
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Disclosed are a thermal fuse resistor having a case injection-molded by using thermosetting resin having heat resistance less than that of a filler, a manufacturing method of the thermal fuse resistor, and a method of installing the thermal fuse resistor such that a resistor and a thermal fuse are laid down on a printed circuit board. In the thermal fuse resistor, through changing a material of the case, the case has a lighter weight and is not easily broken, so that the thermal fuse resistor is advantageously used for an electronic appliance because of its lightness and slimness. The thickness of the case of the thermal fuse resistor serves as the thickness of the electronic appliance employing the thermal fuse resistor, so that the thermal fuse resistor allows the electronic appliance to have a slim structure.

Claims

1. A thermal fuse resistor comprising:

a resistor;

a thermal fuse disconnecting a circuit as heat is applied thereto from the resistor;

a lead wire connecting the resistor with the thermal fuse in series;

a case provided with an open surface used to receive the resistor and the thermal fuse therein in a state in which an end of the lead wire is drawn out of the case and provided at one wall surface thereof with a drawing groove used to draw the lead wire; and

a filler filled in the case to bury the resistor and the thermal fuse therein and including silicon dioxide,

wherein the case is formed by injection-molding thermosetting resin having heat resistance less than heat resistance of the filler,

the resistor and the thermal fuse are provided in the case such that the resistor and the thermal fuse face the open surface side by side,

a wall surface of the case facing the open surface has a thickness in a range of about 0.5 mm to about 1.5 mm, and a thickness of a first portion of the wall of the case in which the resistor is provided is smaller than a thickness of a second portion of the wall of the case in which the thermal fuse is provided, such that the resistor and the thermal fuse, both provided in the case, are aligned with each other on substantially the same level relative to the open surface.