×

Method and apparatus for automatic application and monitoring of a structure to be applied onto a substrate

  • US 8,400,503 B2
  • Filed: 07/16/2004
  • Issued: 03/19/2013
  • Est. Priority Date: 12/23/2003
  • Status: Active Grant
First Claim
Patent Images

1. A method for automatic application and monitoring of a structure to be applied onto a substrate, the method comprising:

  • determining a reference contour by utilizing a first camera in a leading direction to record a plurality of images;

    regulating the progression of the structure to be applied according to the reference contour;

    guiding an application facility based on the images recorded by the first camera;

    applying the structure onto the substrate by the application facility according to the reference contour determined by the first camera; and

    monitoring the structure applied onto the substrate by the application facility utilizing a second camera in trailing direction;

    wherein the method is performed such that the cameras have an overlapping area on a circular line, a segment of the circular line is assigned to images of each camera, at least one of the reference contour and the applied structure progresses relative to the cameras from one camera to the next camera, and an automatic switch is made when the applied structure or the reference contour progresses relative to the cameras from the segment of the circular line of one camera via the overlapping area to the segment of the circular line of another camera.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×