Capacitor with direct DC connection to substrate

• US 8,400,775 B2
• Filed: 07/06/2007
• Issued: 03/19/2013
• Est. Priority Date: 07/06/2007
• Status: Active Grant

• Current Assignee: GM Global Technology Operations LLC (General Motors Company)
• Original Assignee: GM Global Technology Operations LLC (General Motors Company)
• Inventors: Ward, Terence G., John, George, Yankoski, Edward P., Nelson, David F., Smith, Gregory S., Nagashima, James M.
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US11/774,329
• Publication Number:
  US 20090009980A1
• Time in Patent Office: 2,083 Days
• Field of Search: 361/775, 361/803, 257690-692
• US Class Current: 361/763
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.

Claims

1. A subcomponent for a power inverter module, comprising:

a housing;

a capacitor having a terminal and integrated into the housing;

a substrate mounted on the housing;

a power semiconductor switch incorporated into the substrate;

at least one direct current (DC) tab coupled to the power semiconductor switch, wherein the at least one direct current (DC) tab is directly connected to the terminal of the capacitor, wherein the capacitor is disposed below the substrate; and

a bus terminal extending from the housing and coupled to an input terminal of the capacitor for providing electrical connectivity to a power source, wherein the capacitor is disposed on the bus terminal.

2. The subcomponent for a power inverter module of claim 1, wherein the at least one direct current (DC) tab is connected to an input terminal of the power semiconductor switch.

3. The subcomponent for a power inverter module of claim 1, wherein the housing is mounted to a chassis for structural support.

4. The subcomponent for a power inverter module of claim 1, further including a DC bus bar coupled to an input terminal of the capacitor and integrated into the capacitor housing to provide electrical connectivity to a DC power source.

5. The subcomponent for a power inverter module of claim 1, wherein the capacitor is circularly disposed about a centerline.

6. The subcomponent for a power inverter module of claim 1, further including an alternating current (AC) terminal coupled to an output terminal of the power semiconductor switch and integrated into the capacitor housing to provide electrical connectivity to a load.

7. The subcomponent for a power inverter module of claim 1, wherein the direct current tab comprises a bus to transfer electricity from the capacitor to the substrate.

8. The subcomponent of claim 1, wherein the terminal comprises an end of the capacitor.

9. The subcomponent of claim 1, wherein the capacitor is attached to direct current (DC) bus terminals at two locations on opposite sides of the substrate.

10. The subcomponent of claim 1, wherein the substrate is mounted directly to the capacitor.

11. The subcomponent of claim 1, wherein the subcomponent includes only one capacitor.