Monolithic integrated CMUTs fabricated by low-temperature wafer bonding

• US 8,402,831 B2
• Filed: 03/03/2010
• Issued: 03/26/2013
• Est. Priority Date: 03/05/2009
• Status: Active Grant

• Current Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Original Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Inventors: Kupnik, Mario, Khuri-Yakub, Butrus T.
• Primary Examiner(s): SAINT SURIN, JACQUES M
• Application Number:
  US12/660,807
• Publication Number:
  US 20100225200A1
• Time in Patent Office: 1,119 Days
• Field of Search: 736/49, 735/143.2, 295/94, 310/300
• US Class Current: 73/649
• CPC Class Codes: B06B 1/0292 Electrostatic transducers, e.g. electret-type
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

Low temperature wafer bonding (temperature of 450° C. or less) is employed to fabricate CMUTs on a wafer that already includes active electrical devices. The resulting structures are CMUT arrays integrated with active electronics by a low-temperature wafer bonding process. The use of a low-temperature process preserves the electronics during CMUT fabrication. With this approach, it is not necessary to make compromises in the CMUT or electronics designs, as is typical of the sacrificial release fabrication approach. Various disadvantages of sacrificial release, such as low process control, poor design flexibility, low reproducibility, and reduced performance are avoided with the present approach. With this approach, a CMUT array can be provided with per-cell electrodes connected to the substrate integrated circuitry. This enables complete flexibility in electronically assigning the CMUT cells to CMUT array elements.

Claims

1. A capacitive micromachined ultrasonic transducer (CMUT) array comprising:

an integrated circuit (IC) substrate including one or more active electrical devices; and

a CMUT membrane layer including membranes for each transducer element of said CMUT array;

wherein said CMUT membrane layer is attached to said IC substrate by a method that includes low-temperature wafer bonding performed after said active electrical devices are present in said substrate.

2. The CMUT array of claim 1, wherein each transducer element of said array includes one or more CMUT cells, and wherein said IC substrate provides separate electrical cell electrodes for each CMUT cell of said array.

3. The CMUT array of claim 2, wherein an assignment of said cells to said transducer elements is configured to be electrically configured by said IC substrate.

4. The CMUT array of claim 1, wherein each transducer element of said array includes one or more CMUT cells, and wherein said IC substrate provides an element electrode for each transducer element, wherein each of said element electrodes is a collective electrode for all cells of the corresponding transducer element.

5. The CMUT array of claim 4, wherein a configuration of said transducer elements in said CMUT array is configured to be electrically configured by said IC substrate.

6. The CMUT array of claim 1, wherein said IC substrate comprises CMOS circuitry.

7. A method of making a capacitive micromachined ultrasonic transducer (CMUT) array, the method comprising:

providing a substrate;

fabricating one or more active electrical devices on said substrate to provide an integrated circuit (IC) substrate;

providing a CMUT membrane wafer including a CMUT membrane layer; and

bonding said CMUT membrane wafer to said IC substrate using a low-temperature wafer bonding process;

wherein said CMUT membrane layer includes membranes for each transducer of said CMUT array.

8. The method of claim 7, wherein said low-temperature wafer bonding process requires no processing or annealing temperature greater than 450°

C.

9. The method of claim 7, wherein each transducer element of said array includes one or more CMUT cells, and further comprising fabricating separate cell electrodes for each of said CMUT cells on said substrate.

10. The method of claim 7, wherein each transducer element of said array includes one or more CMUT cells, and further comprising fabricating element electrodes for each of said transducer elements on said substrate, wherein each of said element electrodes is a collective electrode for all cells of the corresponding transducer element.

11. The method of claim 7, further comprising fabricating CMUT electrodes on said substrate by depositing an insulator on top of metal electrodes, followed by planarizing the substrate.

12. The method of claim 7, further comprising fabricating CMUT electrodes on said substrate by depositing metal on a planarized substrate using a lift-off process.

13. The method of claim 7, further comprising fabricating CMUT electrodes on said substrate by performing a non-aligned bond of a semiconductor electrode layer to said substrate with a low-temperature bonding process, followed by patterning said electrode layer to form electrodes.

14. The method of claim 7, further comprising defining CMUT cells in said CMUT membrane wafer via local oxidation of silicon.

15. The method of claim 7, further comprising defining CMUT cells in said CMUT membrane wafer via deposition of an insulator followed by patterning said insulator.

16. The method of claim 7, further comprising defining CMUT cells in said CMUT membrane wafer via patterning said CMUT membrane layer.

17. The method of claim 7, wherein said low-temperature wafer bonding process is a direct bonding process.

18. The method of claim 7, wherein said low-temperature wafer bonding process makes use of one or more intermediate bonding layers.

19. The method of claim 7, wherein said low-temperature wafer bonding process comprises a bonding process selected from the group consisting of:

anodic bonding, fusion bonding, plasma assisted fusion bonding, chemically assisted fusion bonding, glass frit bonding, solder bonding, eutectic bonding, thermal compression bonding, and polymer bonding.

20. The method of claim 7, wherein no feature-level horizontal alignment is required for said bonding.