Metal film encapsulation
First Claim
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1. A device comprising:
- an electrochemical device with at least one notch;
a metal foil comprising a surface; and
an electronically insulating layer wherein said insulating layer contacts said surface of said metal foil;
wherein said metal foil encapsulates said electrochemical device and a portion of said metal foil extends over said notch providing an electrical contact tab on said metal foil over the notched portion of said electrochemical device; and
wherein said insulating layer does not cover the electrical contact tab on said metal foil.
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Abstract
The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
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Citations
19 Claims
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1. A device comprising:
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an electrochemical device with at least one notch; a metal foil comprising a surface; and an electronically insulating layer wherein said insulating layer contacts said surface of said metal foil; wherein said metal foil encapsulates said electrochemical device and a portion of said metal foil extends over said notch providing an electrical contact tab on said metal foil over the notched portion of said electrochemical device; and wherein said insulating layer does not cover the electrical contact tab on said metal foil. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification