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Handling layer for transparent substrate

  • US 8,405,169 B2
  • Filed: 10/15/2010
  • Issued: 03/26/2013
  • Est. Priority Date: 10/15/2010
  • Status: Active Grant
First Claim
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1. A device, comprising:

  • a transparent wafer having a top surface and an opposing back surface;

    a micro-electromechanical system (MEMS) device disposed on the top surface;

    an opaque layer disposed on the back surface of the transparent wafer; and

    a conductive layer disposed on the opaque layer, wherein the conductive layer includes a non-metal layer.

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