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Non-peripherals processing control module having improved heat dissipating properties

  • US 8,405,969 B2
  • Filed: 10/18/2010
  • Issued: 03/26/2013
  • Est. Priority Date: 10/22/2002
  • Status: Active Grant
First Claim
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1. A non-peripheral based encasement for a computer processing unit comprising:

  • a chassis shaped and sized for housing a processing system having at least one processor, wherein the chassis comprises a back plane operably connected to the processing system that provides support for connecting peripheral devices and other computing components, wherein said back plane comprises a plurality of ports for connecting said peripheral devices and components.

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