Electronic housing, assemblies therefor and methods of making same
First Claim
1. A cover assembly comprising:
- a frame, the frame including a cross member and a leg extending substantially perpendicular from each of a first end and a second end of the cross member, and the frame having an outer mating surface offset from an opposing inner mating surface of the legs by a frame thickness, and the cross member and the legs of the frame having a joining surface offset from the inner surface of the legs to join with another frame; and
a cover coupled to the frame, the cover having a first edge member and a second edge member extending respectively from a first side and a second side of a base thereof, a first portion of each edge member extending substantially perpendicular to the base and having a first mating surface delineated from a second mating surface of a second portion of the edge member by a primary recess, and wherein each edge member is configured such that, when the edge member is bent at the primary recess at a substantially perpendicular angle to transition the cover from a first bent configuration to a second bent configuration, the second mating surface of each edge member is moved into an abutting relationship with the inner mating surface of the frame with the second portion of the edge member positioned between the inner mating surface and the joining surface.
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0 Petitions
Accused Products
Abstract
An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.
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Citations
12 Claims
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1. A cover assembly comprising:
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a frame, the frame including a cross member and a leg extending substantially perpendicular from each of a first end and a second end of the cross member, and the frame having an outer mating surface offset from an opposing inner mating surface of the legs by a frame thickness, and the cross member and the legs of the frame having a joining surface offset from the inner surface of the legs to join with another frame; and a cover coupled to the frame, the cover having a first edge member and a second edge member extending respectively from a first side and a second side of a base thereof, a first portion of each edge member extending substantially perpendicular to the base and having a first mating surface delineated from a second mating surface of a second portion of the edge member by a primary recess, and wherein each edge member is configured such that, when the edge member is bent at the primary recess at a substantially perpendicular angle to transition the cover from a first bent configuration to a second bent configuration, the second mating surface of each edge member is moved into an abutting relationship with the inner mating surface of the frame with the second portion of the edge member positioned between the inner mating surface and the joining surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification