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System and method for numerically evaluating thermal comfort inside an enclosure

  • US 8,407,032 B2
  • Filed: 06/10/2010
  • Issued: 03/26/2013
  • Est. Priority Date: 07/14/2009
  • Status: Expired due to Fees
First Claim
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1. A method, implemented in a computing device, for numerically evaluating thermal comfort in an actual enclosure having a non-uniform thermal environment, comprising:

  • performing a numerical analysis on a calibration enclosure including a thermal manikin in a uniform thermal environment based on a given set of boundary conditions for the uniform thermal environment;

    performing a numerical analysis on the actual enclosure including one or more thermal manikins in the non-uniform thermal environment based on a set of boundary conditions for the non-uniform thermal environment;

    computing an equivalent temperature (teq) of each body part of the one or more thermal manikins in the non-uniform thermal environment based on the numerical analysis performed in the uniform thermal environment, non-uniform thermal environment, and surface temperature of each body part; and

    evaluating the thermal comfort in the actual enclosure based on each computed teq using a numerical thermal comfort analysis module, wherein parameters that define the set of boundary conditions for the uniform thermal environment and the non-uniform thermal environment are selected from the group consisting of inlet parameters, thermal manikin body surface parameter, enclosure wall parameters, semi transparent wall parameters, thermal manikin clothing parameters and outlet parameters.

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