×

Method and apparatus for adhesive bond curing

  • US 8,409,389 B2
  • Filed: 12/13/2006
  • Issued: 04/02/2013
  • Est. Priority Date: 12/13/2006
  • Status: Active Grant
First Claim
Patent Images

1. A method of curing a laminated resin part comprising:

  • loading the part onto a support;

    sliding the support having the part thereon along a first axis from a part loading position to a part curing position;

    assembling a reinforcement layer of resin material and a fitting to a pre-selected portion of the part, the pre-selected portion of the part being less than an entirety of the part;

    applying a pressure to the pre-selected portion of the part by moving a pair of clamps along a second axis transverse to the first axis from a standby position to a clamping position in which the clamps engage opposite faces of the pre-selected portion of the part;

    heating the pre-selected portion of the part via the clamps to cure the pre-selected portion of the part to bond the reinforcement layer of resin material or the fitting to the part;

    cooling the pre-selected portion of the part after the pre-selected portion of the part has been cured via a cooling fan; and

    releasing the pressure applied to the pre-selected portion of the part after the pre-selected portion has cooled by moving the clamps from the clamping position to the standby position.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×