Methods of forming a photoresist-comprising pattern on a substrate

• US 8,409,457 B2
• Filed: 08/29/2008
• Issued: 04/02/2013
• Est. Priority Date: 08/29/2008
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Zhang, Zishu, Zhu, Hongbin, deVilliers, Anton, Schrinsky, Alex
• Primary Examiner(s): Deo, Duy
• Assistant Examiner(s): ANGADI, MAKI A
• Application Number:
  US12/201,744
• Publication Number:
  US 20100055913A1
• Time in Patent Office: 1,677 Days
• Field of Search: 216/37, 216/41, 430/315, 430/322, 438/725, 438/736, 438/737
• US Class Current: 216/41
• CPC Class Codes: G03F 7/0035 Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking

Abstract

A method of forming a photoresist-comprising pattern on a substrate includes forming a patterned first photoresist having spaced first masking shields in at least one cross section over a substrate. The first masking shields are exposed to a fluorine-containing plasma effective to form a hydrogen and fluorine-containing organic polymer coating about outermost surfaces of the first masking shields. A second photoresist is deposited over and in direct physical touching contact with the hydrogen and fluorine-containing organic polymer coating. The second photoresist which is in direct physical touching contact with the hydrogen and fluorine-containing organic polymer coating is exposed to a pattern of actinic energy and thereafter spaced second masking shields are formed in the one cross section which comprise the second photoresist and correspond to the actinic energy pattern. The first and second masking shields together form at least a part of a photoresist-comprising pattern on the substrate. Other embodiments are disclosed.

Claims

1. A method of forming a photoresist-comprising pattern on a substrate, comprising:

forming a patterned first photoresist over a substrate, the patterned first photoresist comprising spaced first masking shields in at least one cross section;

exposing the first masking shields to a fluorine-containing plasma to form a hydrogen and fluorine-containing organic polymer coating about outermost surfaces of the first masking shields;

depositing a second photoresist over and in direct physical touching contact with the hydrogen and fluorine-containing organic polymer coating received about the first masking shields; and

exposing the second photoresist which is in direct physical touching contact with the hydrogen and fluorine-containing organic polymer coating to a pattern of actinic energy and thereafter forming spaced second masking shields in the one cross section which comprise the second photoresist and correspond to the actinic energy pattern, the first and second masking shields together comprising a photoresist-comprising pattern on the substrate.

2. The method of claim 1 wherein the second masking shields are spaced from the first masking shields in the one cross section.

3. The method of claim 1 wherein at least a portion of the second masking shields are received elevationally atop the first masking shields in the one cross section.

4. The method of claim 1 wherein the spaced first masking shields prior to said exposing have lateral dimensions and spacings between adjacent of the first masking shields in the one cross section, said exposing not changing said dimensions and said spacings.

5. The method of claim 1 wherein the spaced first masking shields prior to said exposing have lateral dimensions and spacings between adjacent of the first masking shields in the one cross section, said exposing changing said dimensions and said spacings.

6. The method of claim 1 wherein the first photoresist and the second photoresist are of the same composition.

7. The method of claim 1 wherein the first photoresist and the second photoresist are of different composition.

8. The method of claim 1 wherein the first photoresist and the second photoresist are of the same type regarding positive and negative.

9. The method of claim 8 wherein the first photoresist and the second photoresist are positive type.

10. The method of claim 8 wherein the first photoresist and the second photoresist are negative type.

11. The method of claim 1 wherein the first photoresist and the second photoresist are of different type regarding positive and negative.

12. The method of claim 1 comprising etching substrate material received elevationally inward of the first photoresist using the photoresist-comprising pattern as an etch mask during such etching.

13. The method of claim 12 being void of etching any substrate material received elevationally inward of the first photoresist between forming of the first masking shields comprising the coating and forming of the second masking shields.

14. The method of claim 1 being void of any exposure of the substrate to baking between formation of the hydrogen and fluorine-containing organic polymer coating and the deposition of second photoresist.

15. The method of claim 1 being void of any exposure of the substrate to liquid between formation of the hydrogen and fluorine-containing organic polymer coating and the deposition of second photoresist.

16. A method of forming a photoresist-comprising pattern on a substrate, comprising:

forming a patterned first photoresist over a substrate, the patterned first photoresist comprising spaced first masking shields in at least one cross section;

within a chamber, etching the first masking shields to reduce their respective widths in the one cross section;

within the chamber and after the etching, exposing the spaced first masking shields to a fluorine-containing plasma to form a hydrogen and fluorine-containing organic polymer coating about outermost surfaces of the reduced-width first masking shields, the substrate not being removed from the chamber between said etching and said exposing;

depositing a second photoresist over the hydrogen and fluorine-containing organic polymer coating received about the first masking shields; and

patterning the second photoresist to form spaced second masking shields in the one cross section which comprise the second photoresist, the first and second masking shields together comprising a photoresist-comprising pattern on the substrate.

17. The method of claim 16 wherein the second photoresist is deposited in direct physical touching contact with the hydrogen and fluorine-containing organic polymer coating received about the first masking shields.

18. The method of claim 16 comprising forming the fluorine-containing plasma using a gas comprising at least one of a fluorocarbon, a hydrofluorocarbon, and NF₃, including any mixtures thereof.

19. The method of claim 16 wherein the etching also reduces elevation of the first masking shields.

20. The method of claim 19 wherein the etching reduces more width than elevation of the first masking shields.

21. The method of claim 19 wherein the etching reduces more elevation than width of the first masking shields.

22. The method of claim 19 wherein the etching reduces equal width and elevation of the first masking shields.

23. The method of claim 16 wherein the etching comprising injecting an etching gas into the chamber and the exposing comprises injecting a fluorine-containing gas other than the etching gas into the chamber, said injecting of the etching gas being ceased prior to initiating said injecting of the fluorine-containing gas.

24. The method of claim 16 wherein the etching comprising injecting an etching gas into the chamber and the exposing comprises injecting a fluorine-containing gas other than the etching gas into the chamber, said injecting of the etching gas not being ceased prior to initiating said injecting of the fluorine-containing gas.

25. The method of claim 16 wherein the etching comprises plasma etching.

26. The method of claim 16 wherein the fluorine-containing plasma comprises plasma generation within the chamber.

27. The method of claim 16 wherein the fluorine-containing plasma comprises plasma generation remote from the chamber.

28. A method of forming a photoresist-comprising pattern on a substrate, comprising:

forming a patterned first photoresist over a substrate, the patterned first photoresist comprising spaced first masking shields in at least one cross section;

exposing the spaced first masking shields to a plasma, the plasma simultaneously comprising a reactive component which modifies respective widths of the first masking shields in the one cross section and a fluorine-containing component other than the reactive component which forms a hydrogen and fluorine-containing organic polymer coating about outermost surfaces of the modified-width first masking shields;

depositing a second photoresist over the hydrogen and fluorine-containing organic polymer coating received about the first masking shields; and

patterning the second photoresist to form spaced second masking shields in the one cross section which comprise the second photoresist, the first and second masking shields together comprising a photoresist-comprising pattern on the substrate.

29. The method of claim 28 wherein the exposing reduces respective widths of the first masking shields in the one cross section.

30. The method of claim 28 wherein the exposing increases respective widths of the first masking shields in the one cross section.

31. The method of claim 28 wherein the second photoresist is deposited in direct physical touching contact with the hydrogen and fluorine-containing organic polymer coating received about the first masking shields.

32. The method of claim 28 wherein the reactive component is derived from O₂ and at least one of Cl₂ and HBr, including mixtures thereof.

33. The method of claim 28 being void of any exposure of the substrate to baking between formation of the hydrogen and fluorine-containing organic polymer coating and the deposition of second photoresist.

34. A method of forming a photoresist-comprising pattern on a substrate, comprising:

forming a first photoresist over a substrate, the first photoresist having a planar elevationally outermost surface;

exposing the first photoresist to a fluorine-containing plasma to form a hydrogen and fluorine-containing organic polymer coating on the planar elevationally outermost surface;

depositing a second photoresist over and in direct physical touching contact with the hydrogen and fluorine-containing organic polymer coating received on the planar elevationally outermost surface of the first photoresist;

patterning the second photoresist to form spaced masking shields in at least one cross section which comprise the second photoresist, the patterning comprising etching the second photoresist to stop on the hydrogen and fluorine-containing organic polymer coating; and

after stopping the etching on the hydrogen and fluorine-containing organic polymer coating, etching the hydrogen and fluorine-containing organic polymer coating received between the spaced masking shields and the first photoresist there-under between the spaced masking shields using the spaced masking shields as a mask to form a photoresist-comprising pattern on the substrate which comprises the second photoresist received over the hydrogen and fluorine-containing organic polymer coating received over the first photoresist.

35. The method of claim 34 wherein the substrate has a non-planar elevationally outermost surface immediately prior to forming the first photoresist.

36. The method of claim 34 wherein the first photoresist and the second photoresist are of different composition.

37. The method of claim 34 wherein the first photoresist and the second photoresist are of different type regarding positive and negative.

38. The method of claim 34 comprising forming the fluorine-containing plasma using a gas comprising at least one of a fluorocarbon, a hydrofluorocarbon, NF₃ and N₂, including any mixtures thereof.