System and method for the manufacture of surgical blades

• US 8,409,462 B2
• Filed: 02/09/2011
• Issued: 04/02/2013
• Est. Priority Date: 03/11/2002
• Status: Expired due to Term

• Current Assignee: Beaver-Visitec International, Inc (BVI Medical, Inc.)
• Original Assignee: Beaver-Visitec International, Inc (BVI Medical, Inc.)
• Inventors: Keenan, Joseph Francis, Daskal, Vadim Mark, Hughes, James Joseph
• Primary Examiner(s): Deo, Duy
• Application Number:
  US12/929,707
• Publication Number:
  US 20110192819A1
• Time in Patent Office: 783 Days
• Field of Search: None
• US Class Current: 216/101
• CPC Class Codes: A61B 17/32 Surgical cutting instruments A61B18/042 takes precedence; suture cutters A61B17/0467; instruments for ligaturing or cutting A61B17/128; instruments for rupturing the amniotic membrane A61B17/4208; specially adapted knives for eye surgery A61F9/0133
• CPC Class Codes: A61B 17/3211 Surgical scalpels, knives; Accessories therefor
• CPC Class Codes: A61B 2017/00526 Methods of manufacturing
• CPC Class Codes: B28D 5/022 by cutting with discs or wheels

Abstract

A method for manufacturing surgical blades from either a crystalline or poly-crystalline material, preferably in the form of a wafer, is disclosed. The method includes preparing the crystalline or poly-crystalline wafers by mounting them and machining trenches into the wafers. The methods for machining the trenches, which form the bevel blade surfaces, include a diamond blade saw, laser system, ultrasonic machine, and a hot forge press. The wafers are then placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or poly-crystalline material are removed uniformly, producing single or double bevel blades. Nearly any angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5-500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.

Claims

1. A method for manufacturing a cutting device from a crystalline material, the method comprising:

making at least one blade profile in a wafer of a first material, said wafer remaining exposed during said making to form said at least one blade profile; and

isotropically etching the wafer to form at least one blade comprising the at least one blade profile, said wafer remaining exposed during said etching to form said at least one blade.

2. The method according to claim 1, wherein the making step comprises:

machining at least one blade profile in the wafer with at least one of a dicing blade and a laser beam.

3. The method according to claim 2, wherein the laser beam is produced by at least one of an excimer laser, a solid state laser, and a laser waterjet laser.

4. The method according to claim 2, wherein the laser beam comprises a wavelength in the range of about 150 nanometers to 11,000 nanometers.

5. The method according to claim 1, wherein the making step comprises:

machining at least one blade profile in the wafer with a laser beam ablating an amount of the first material required to form the at least one blade profile in the wafer.

6. The method according to claim 5, wherein the making step comprises:

before the machining of the at least one blade profile in the wafer with the laser beam, positioning the laser beam relative to the wafer by at least one of a mounting assembly with multi-axis control, an internal laser light beam mask, and a galvanometer head.

7. The method according to claim 1, wherein the etching comprises:

placing the wafer comprising the at least one blade profile on a wafer boat;

immersing the wafer boat and the wafer comprising the at least one blade profile in an isotropic acid bath;

etching the wafer such that the first material of the wafer is removed on any exposed surface, whereby a sharp blade edge is etched in the shape of the at least one blade profile.

8. The method according to claim 7, wherein the isotropic acid bath comprises:

at least one of a hydrofluoric acid and nitric acid.

9. The method according to claim 8, wherein the isotropic acid bath further comprises:

at least one of acetic acid and water.

10. The method according to claim 1, wherein the etching comprises:

placing the wafer comprising the at least one blade profile in a wafer boat;

spraying a spray etchant at the wafer boat and the wafer comprising the at least one blade profile;

etching the wafer with the spray etchant such that the first material of the wafer is removed on any exposed surface, whereby a sharp blade edge is etched in the shape of the at least one blade profile.

11. The method according to claim 1, wherein the etching comprises:

placing the wafer comprising the at least one blade profile on a wafer boat;

immersing the wafer boat and the wafer comprising the at least one blade profile in an isotropic xenon difluoride, sulfur hexafluoride or similar fluorinated gas environment;

etching the wafer with the isotropic xenon difluoride, sulfur hexafluoride or similar fluorinated gas such that the first material of the wafer is removed on any exposed surface, whereby a sharp blade edge is etched in the shape of the at least one blade profile.

12. The method according to claim 1, wherein the etching comprises:

placing the wafer comprising the at least one blade profile in a wafer boat;

immersing the wafer boat and the wafer comprising the at least one blade profile in an electrolytic bath;

etching the wafer with the electrolytic bath such that the first material of the wafer is removed on any exposed surface, whereby a sharp blade edge is etched in the shape of the at least one blade profile.

13. The method according to claim 1, further comprising singulating the at least one blade.

14. The method according to claim 13, wherein the singulating comprises:

dicing the machined wafer with at least one of a dicing blade and a laser beam.

15. The method according to claim 1, further comprising:

dicing the machined wafer after making the at least one blade profile in the form of single bevel blade and prior to the step of etching.

16. The method according to claim 15, wherein the dicing comprises:

dicing the machined wafer with at least one of a dicing blade and a laser beam.

17. The method according to claim 14, wherein the laser beam comprises a wavelength in the range of about 150 nanometers to 11,000 nanometers.

18. The method according to claim 1, wherein the making of the at least one blade profile comprises:

making a first blade profile in the wafer on a first side of the wafer; and

making a second blade profile in the wafer on a second side of the wafer.

19. The method according to claim 2, wherein the laser beam comprises a wavelength of about 1064 nanometers or about 355 nanometers.

20. The method according to claim 2, wherein the laser beam is produced by a YaG laser.

21. The method according to claim 20, wherein the laser beam comprises a wavelength of about 1064 nanometers or about 355 nanometers.

22. The method according to claim 1, wherein the making of the at least one blade profile in the wafer comprises making the at least one blade profile to a depth of about 50 to 90 percent of a thickness of the wafer.

23. The method according to claim 18 wherein the making of at least one of the first blade profile and the second blade profile comprises making the at least one of the first blade profile and the second blade profile to a depth of about 25 to 49 percent of a thickness of the wafer.

24. The method according to claim 1, wherein the first material of the wafer comprises at least one of a crystalline material and a polycrystalline material.

25. The method according to claim 1, further comprising converting at least a portion of the first material of the wafer into a second material.

26. The method according to claim 25, wherein the converting is performed after the etching.

27. The method according to claim 25, wherein the converting comprises at least one of thermal oxidation, silicon nitride conversion and silicon carbide conversion.