Conformal shielding process using flush structures
First Claim
1. A method of manufacturing a module comprising:
- providing an electronic meta-module comprising a substrate, a plurality of component areas on a surface of the substrate for a plurality of modules, a plurality of exposed metallic structures, wherein certain component areas of the plurality of component areas are associated with the exposed metallic structures, and a plurality of continuous metal traces on the surface of the substrate, wherein each of the continuous metal traces substantially extends about a periphery of one of the certain component areas that are associated with the exposed metallic structures, and a bottom surface of each of the plurality of exposed metallic structures is located above a portion of one of the plurality of continuous metal traces;
forming a body of a dielectric material that covers the plurality of component areas, wherein a top surface of each of the exposed metallic structures is substantially flush with a top portion of an exterior surface of the body; and
applying an electromagnetic shield material over at least portions of the exterior surface of the body for each of the certain component areas and on the top surface of each of the exposed metallic structures to form electromagnetic shields over the certain component areas, and wherein the exposed metallic structures provide a conductive path between the electromagnetic shields and the plurality of continuous metal traces on the surface of the substrate.
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Accused Products
Abstract
In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
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Citations
18 Claims
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1. A method of manufacturing a module comprising:
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providing an electronic meta-module comprising a substrate, a plurality of component areas on a surface of the substrate for a plurality of modules, a plurality of exposed metallic structures, wherein certain component areas of the plurality of component areas are associated with the exposed metallic structures, and a plurality of continuous metal traces on the surface of the substrate, wherein each of the continuous metal traces substantially extends about a periphery of one of the certain component areas that are associated with the exposed metallic structures, and a bottom surface of each of the plurality of exposed metallic structures is located above a portion of one of the plurality of continuous metal traces; forming a body of a dielectric material that covers the plurality of component areas, wherein a top surface of each of the exposed metallic structures is substantially flush with a top portion of an exterior surface of the body; and applying an electromagnetic shield material over at least portions of the exterior surface of the body for each of the certain component areas and on the top surface of each of the exposed metallic structures to form electromagnetic shields over the certain component areas, and wherein the exposed metallic structures provide a conductive path between the electromagnetic shields and the plurality of continuous metal traces on the surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of manufacturing a module, the method comprising:
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forming, a component on a laminate; forming a first metal grid on the laminate, wherein the first metal grid substantially encircles the component; forming a surface mount structure on top of at least a portion of the first metal grid, wherein the surface mount structure is electrically conductive; forming an overmold body over the component to the extent that a top surface of the overmold body is substantially flush with the top surface of the surface mount structure, and wherein the top surface of the surface mount structure remains exposed without requiring cutting or drilling to form an opening in the overmold body over the surface mount structure; and forming an electromagnetic shield contacting the overmold body and contacting the surface mount structure. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification