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Semiconductor device manufacturing method

  • US 8,409,930 B2
  • Filed: 03/25/2011
  • Issued: 04/02/2013
  • Est. Priority Date: 03/27/2007
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing a semiconductor device, comprising:

  • mounting a plurality of semiconductor chips over a relay wiring substrate by flip-chip connections;

    bonding a heat radiating plate to a back surface of a main wiring substrate which has an opening therethrough;

    bonding the relay wiring substrate equipped with the semiconductor chips to the heat radiating plate in the opening of the main wiring substrate using a bonding material having thermal conductivity;

    connecting bonding wires between the relay wiring substrate and the main wiring substrate;

    applying a thermal conductive material to each of back surfaces of the semiconductor chips; and

    covering the opening of the main wiring substrate with a metal sealing plate, so that the metal sealing plate is connected to the semiconductor chips by the thermal conductive material.

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