Semiconductor device and manufacturing method thereof
First Claim
1. A semiconductor device comprising:
- an oxide semiconductor layer formed over a substrate;
a source electrode and a drain electrode formed over the oxide semiconductor layer;
the source electrode and the drain electrode, each is electrically connected to the oxide semiconductor layer;
a gate insulating layer formed over the oxide semiconductor layer, the source electrode and the drain electrode; and
a gate electrode formed over the gate insulating layer,wherein the source electrode and the drain electrode include an oxide region formed by oxidizing a side surface of the source electrode and the drain electrode.
1 Assignment
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Accused Products
Abstract
An object is to provide a semiconductor device with a novel structure and favorable characteristics. A semiconductor device includes an oxide semiconductor layer, a source electrode and a drain electrode electrically connected to the oxide semiconductor layer, a gate insulating layer covering the oxide semiconductor layer, the source electrode, and the drain electrode, and a gate electrode over the gate insulating layer. The source electrode and the drain electrode include an oxide region formed by oxidizing a side surface thereof. Note that the oxide region of the source electrode and the drain electrode is preferably formed by plasma treatment with a high frequency power of 300 MHz to 300 GHz and a mixed gas of oxygen and argon.
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Citations
9 Claims
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1. A semiconductor device comprising:
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an oxide semiconductor layer formed over a substrate; a source electrode and a drain electrode formed over the oxide semiconductor layer;
the source electrode and the drain electrode, each is electrically connected to the oxide semiconductor layer;a gate insulating layer formed over the oxide semiconductor layer, the source electrode and the drain electrode; and a gate electrode formed over the gate insulating layer, wherein the source electrode and the drain electrode include an oxide region formed by oxidizing a side surface of the source electrode and the drain electrode. - View Dependent Claims (2, 3, 4, 5)
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6. A manufacturing method of a semiconductor device, comprising:
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forming an oxide semiconductor layer over a substrate; forming a source electrode and a drain electrode electrically connected to the oxide semiconductor layer; oxidizing a side surface of the source electrode and the drain electrode; forming a gate insulating layer over the oxide semiconductor layer, the source electrode, and the drain electrode after oxidizing the side surface of the source electrode and the drain electrode; and forming a gate electrode over the gate insulating layer. - View Dependent Claims (7, 8, 9)
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Specification