Semiconductor device packages with electromagnetic interference shielding
First Claim
1. A semiconductor package, comprising:
- a substrate includingan upper surface,a lower surface, anda grounding element disposed adjacent to a periphery of the substrate and at least partially extending between the upper surface and the lower surface of the substrate, the grounding element including a connection surface disposed adjacent to and extending downwardly from a substantially planar portion of the upper surface of the substrate, wherein the connection surface is a curved surface extending outwardly from the substantially planar portion;
a package body disposed adjacent to the upper surface of the substrate, a periphery of the package body being laterally recessed with respect to the periphery of the substrate, such that the connection surface of the grounding element is exposed; and
an electromagnetic interference shield disposed adjacent to the package body and physically connected to the connection surface of the grounding element,wherein the grounding element provides an electrical pathway to ground.
1 Assignment
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Accused Products
Abstract
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit; (2) a semiconductor device disposed adjacent to the upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body. A periphery of the package body is laterally recessed, such that a connection surface of the grounding element is electrically exposed and electrically connected to the EMI shield. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
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Citations
22 Claims
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1. A semiconductor package, comprising:
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a substrate including an upper surface, a lower surface, and a grounding element disposed adjacent to a periphery of the substrate and at least partially extending between the upper surface and the lower surface of the substrate, the grounding element including a connection surface disposed adjacent to and extending downwardly from a substantially planar portion of the upper surface of the substrate, wherein the connection surface is a curved surface extending outwardly from the substantially planar portion; a package body disposed adjacent to the upper surface of the substrate, a periphery of the package body being laterally recessed with respect to the periphery of the substrate, such that the connection surface of the grounding element is exposed; and an electromagnetic interference shield disposed adjacent to the package body and physically connected to the connection surface of the grounding element, wherein the grounding element provides an electrical pathway to ground. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor package, comprising:
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a substrate including a first surface, a second opposing surface, and a grounding element at least partially extending between the first surface and the second opposing surface of the substrate, the grounding element corresponding to a remnant of a grounding via and including a connection surface disposed adjacent to a peripheral portion of the first surface of the substrate, wherein the connection surface is a curved surface having a concave profile extending from the first surface; a package body disposed adjacent to the first surface of the substrate, a periphery of the package body being recessed with respect to a periphery of the substrate, such that the connection surface of the grounding element is exposed adjacent to the peripheral portion of the first surface of the substrate; and an electromagnetic interference shield disposed adjacent to the package body and directly connected to the connection surface of the grounding element. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A semiconductor package, comprising:
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a substrate including an upper surface, a lower surface, and a grounding element at least partially extending between the upper surface and the lower surface of the substrate, the grounding element including a first surface and a second surface, and at least a portion of the first surface is exposed at a periphery of the substrate, wherein the first surface is a curved surface having a concave profile extending from the upper surface of the substrate, and wherein the first surface is adjacent to the upper surface of the substrate, the second surface is adjacent to the lower surface of the substrate, and the first surface is recessed relative to the second surface; a package body disposed adjacent to the upper surface of the substrate; and an electromagnetic interference shield disposed adjacent to the package body and electrically connected to at least the first surface of the grounding element. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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Specification