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Semiconductor device packages with electromagnetic interference shielding

  • US 8,410,584 B2
  • Filed: 04/29/2009
  • Issued: 04/02/2013
  • Est. Priority Date: 08/08/2008
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a substrate includingan upper surface,a lower surface, anda grounding element disposed adjacent to a periphery of the substrate and at least partially extending between the upper surface and the lower surface of the substrate, the grounding element including a connection surface disposed adjacent to and extending downwardly from a substantially planar portion of the upper surface of the substrate, wherein the connection surface is a curved surface extending outwardly from the substantially planar portion;

    a package body disposed adjacent to the upper surface of the substrate, a periphery of the package body being laterally recessed with respect to the periphery of the substrate, such that the connection surface of the grounding element is exposed; and

    an electromagnetic interference shield disposed adjacent to the package body and physically connected to the connection surface of the grounding element,wherein the grounding element provides an electrical pathway to ground.

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