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System including thermal control unit having conduit for dispense and removal of liquid thermal interface material

  • US 8,410,802 B2
  • Filed: 12/24/2009
  • Issued: 04/02/2013
  • Est. Priority Date: 12/24/2009
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing;

    at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid; and

    a device adapted to control the flow of the thermal interface material through the at least one conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove a quantity of the thermal interface material from the electronic component.

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