System including thermal control unit having conduit for dispense and removal of liquid thermal interface material
First Claim
1. A system comprising:
- a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing;
at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid; and
a device adapted to control the flow of the thermal interface material through the at least one conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove a quantity of the thermal interface material from the electronic component.
1 Assignment
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Accused Products
Abstract
Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.
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Citations
16 Claims
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1. A system comprising:
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a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing; at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid; and a device adapted to control the flow of the thermal interface material through the at least one conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove a quantity of the thermal interface material from the electronic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising:
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delivering a liquid thermal interface material through a thermal control unit and onto an electronic component, the thermal control unit including at least one conduit through which the liquid thermal interface material may flow; performing a test operation of the electronic component having the thermal interface material thereon; sensing an amount of evaporation of liquid thermal interface material during the test operation and then delivering additional liquid thermal interface material through the thermal control unit to the electronic component during the test operation; and after the performing a test operation, removing at least a portion of the liquid thermal interface material from the electronic component through the thermal control unit. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification