Lithographic apparatus and device manufacturing method utilizing a substrate handler

• US 8,411,252 B2
• Filed: 12/16/2009
• Issued: 04/02/2013
• Est. Priority Date: 12/23/2004
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Jacobs, Hernes, Luttikhuis, Bernardus Antonius Johannes, Van Der Schoot, Harmen Klaas, Vosters, Petrus Matthijs Henricus
• Primary Examiner(s): NGUYEN, HUNG
• Application Number:
  US12/639,457
• Publication Number:
  US 20100085553A1
• Time in Patent Office: 1,203 Days
• Field of Search: 355/30, 355 72- 76, 378/34, 378/35
• US Class Current: 355/72
• CPC Class Codes: G03F 7/70691 Handling of masks or workpieces
• CPC Class Codes: G03F 7/70733 Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
• CPC Class Codes: G03F 7/7075 Handling workpieces outside exposure position, e.g. SMIF box
• CPC Class Codes: G03F 7/70791 Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Abstract

A substrate handler is provided. The substrate handler includes a support surface configured to carry a substrate and a pre-conditioning unit configured to pre-condition the substrate. The substrate handler is configured to move the substrate relative to a substrate table.

Claims

1. A substrate handler, comprising:

a support surface configured to carry a substrate; and

a pre-conditioning unit comprising a device, the device being configured to control a temperature of a substrate and comprising a heat-exchanging element configured to transfer heat away from or to the substrate;

wherein the pre-conditioning unit is configured to pre-condition the substrate before exposure by a projection system; and

wherein the substrate handler is configured to move the substrate relative to a substrate table.

2. The substrate handler of claim 1, wherein:

the heat-exchanging element comprises a heat exchanging plate arranged to be in thermal contact with the substrate during pre-conditioning; and

the heat exchanging plate comprises at least one channel extending therealong, which heat exchanging plate is configured to heat or cool the substrate by thermal conduction.

3. The substrate handler of claim 2, wherein:

the pre-conditioning unit comprises fluid arranged to flow along the at least one channel, whereby heat is conducted to or away from the substrate; and

the substrate handler is configured to maintain the fluid at a substantially constant temperature.

4. The substrate handler of claim 2, wherein:

the pre-conditioning unit is configured to generate an air film between the plate and the substrate during pre-conditioning; and

the air film serves to transfer heat to or from the substrate.

5. The substrate handler of claim 1, wherein the pre-conditioning unit is one of integrated with or disposed substantially adjacent the substrate handler.