Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
First Claim
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1. A carbon powder for electrode having an average particle diameter of not more than 10 μ
- m and a single particle ratio of at least 0.7, whereinthe coefficient of variation of a particle size distribution expressed in the following formula [1] is not more than 0.65;
coefficient of variation of particle size distribution=(d84%−
d16%)/(2×
average particle diameter)
[1]where d84% and d16% represent particle sizes exhibiting cumulative frequencies of 84% and 16% in a frequency distribution obtained by laser diffraction scattering respectively; and
wherein the carbon powder has a BET specific surface area of 1 to 500 m2/g.
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Abstract
Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
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9 Claims
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1. A carbon powder for electrode having an average particle diameter of not more than 10 μ
- m and a single particle ratio of at least 0.7, wherein
the coefficient of variation of a particle size distribution expressed in the following formula [1] is not more than 0.65;
coefficient of variation of particle size distribution=(d84%−
d16%)/(2×
average particle diameter)
[1]where d84% and d16% represent particle sizes exhibiting cumulative frequencies of 84% and 16% in a frequency distribution obtained by laser diffraction scattering respectively; and wherein the carbon powder has a BET specific surface area of 1 to 500 m2/g. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
- m and a single particle ratio of at least 0.7, wherein
Specification