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Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

  • US 8,411,415 B2
  • Filed: 03/14/2012
  • Issued: 04/02/2013
  • Est. Priority Date: 10/20/2006
  • Status: Active Grant
First Claim
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1. A carbon powder for electrode having an average particle diameter of not more than 10 μ

  • m and a single particle ratio of at least 0.7, whereinthe coefficient of variation of a particle size distribution expressed in the following formula [1] is not more than 0.65;


    coefficient of variation of particle size distribution=(d84%

    d
    16%)/(2×

    average particle diameter) 



    [1]where d84% and d16% represent particle sizes exhibiting cumulative frequencies of 84% and 16% in a frequency distribution obtained by laser diffraction scattering respectively; and

    wherein the carbon powder has a BET specific surface area of 1 to 500 m2/g.

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