Power amplifier chassis

• US 8,411,447 B2
• Filed: 12/18/2009
• Issued: 04/02/2013
• Est. Priority Date: 12/18/2009
• Status: Active Grant

• Current Assignee: Teledyne Defense Electronics LLC (Teledyne Technologies Incorporated)
• Original Assignee: Teledyne Paradise Datacom, LLC (Teledyne Technologies Incorporated)
• Inventors: Turner, Stephen D.
• Primary Examiner(s): Dinh, Tuan T
• Assistant Examiner(s): SAWYER, STEVEN T
• Application Number:
  US12/642,160
• Publication Number:
  US 20110149526A1
• Time in Patent Office: 1,201 Days
• Field of Search: 361/730, 361/800
• US Class Current: 361/730
• CPC Class Codes: H05K 7/207 Thermal management, e.g. cabinet temperature control

Abstract

A power amplifier chassis for an n+1 redundant power amplifier system. The power amplifier chassis includes an embedded controller and a power amplifier. The embedded controller operates the power amplifier chassis in a master controller mode or a slave controller mode. When operated in the master controller mode, the embedded controller monitors operating parameters associated with the power amplifier chassis, and can transfer control of the power amplifier system when the embedded controller senses that the monitored operating parameters indicate a failure or impending failure of the power amplifier chassis. When operated in the slave controller mode, the embedded controller receives control instructions from the master controller power amplifier module, and is enabled to reconfigure the power amplifier chassis from the slave controller mode to the master controller mode in response to a failure or imminent failure indication of a first power amplifier chassis operated in master controller mode.

Claims

1. A power amplifier chassis for an n+1 redundant power amplifier system, the power amplifier chassis comprising:

an embedded controller and a radio frequency (RF) power amplifier module for amplifying an RF signal;

the RF power amplifier module disengageable from the power amplifier system while the power amplifier system is in operation;

the embedded controller configured to operate the power amplifier chassis in a master controller mode or a slave controller mode;

wherein when the power amplifier chassis is operated in the master controller mode, the embedded controller monitors at least one operating parameter associated with the power amplifier chassis, and is configured to transfer control of the power amplifier system in response to the embedded controller sensing that at least one of the monitored operating parameters indicates a failure or impending failure of the power amplifier chassis; and

wherein when the power amplifier chassis is operated in the slave controller mode, the embedded controller is configured to receive control instructions from the master controller power amplifier module, and to reconfigure the power amplifier chassis from the slave controller mode to the master controller mode in response to a failure or imminent failure indication of a first power amplifier chassis operated in master controller mode;

wherein the power amplifier chassis further comprises a backplane printed circuit board (PCB) in data communication with a microcontroller, the backplane comprising circuit traces for interconnecting parallel busses that electrically interconnect the backplane PCB to a microcontroller PCB, a rear fan module and a power supply connection;

the microcontroller PCB further comprising control logic necessary for executing master control commands when the power amplifier chassis is assigned as the master controller of the array; and

the microcontroller PCB further comprising logic configured to detect the power amplifier chassis or the RF power amplifier module is failing or about to fail, and to transfer control of an amplifier array to another power amplifier chassis of the amplifier array.

2. The power amplifier chassis of claim 1, wherein the embedded controller further comprises firmware, the firmware configured for controlling an array of 4, 8, or 16 power amplifiers, the array comprising at least one RF amplifier module operated in master controller mode and a plurality of RF amplifier modules operated in slave controller mode, the array configured to operate as a single chassis during system operation.

3. The power amplifier chassis of claim 1, wherein the RF power amplifier module comprises an input port and an output port, wherein at least one of the input port and the output port is connected to the RF power amplifier module through an isolation circuit.

4. The power amplifier chassis of claim 1, wherein the RF power amplifier module comprises an input port and an output port, wherein at least one of the input port and the output port is connected to the RF power amplifier module through a coaxial cable.

5. The power amplifier chassis of claim 1, wherein the RF power amplifier module further comprises a pair of power input ports and the power amplifier chassis further comprises bus bars interconnecting the power input ports to an external power supply.

6. The power amplifier chassis of claim 1, wherein the power amplifier chassis further comprises a booster board and a front panel module connected to cooling fans, and wherein the RF power amplifier module further comprises a third input connected to the booster board.

7. The power amplifier chassis of claim 1, the backplane printed circuit board further comprising an I/O board connected to backplane via data busses.

8. The power amplifier chassis of claim 1, wherein the microcontroller PCB comprising at least one of a main serial port, a serial local port, a flash program port, and an Ethernet port, for communication links between the microcontroller PCB and external devices.

9. The power amplifier chassis of claim 1, further comprising an I/O board, the I/O board comprising a parallel I/O port, a link port, and a switch port for external data links.

10. The power amplifier chassis of claim 1, the microcontroller PCB further comprising logic to monitor operational parameters of the RF power amplifier module and the power amplifier chassis.

11. The power amplifier chassis of claim 2, wherein the firmware defines a hierarchy of control that is communicated to each of the embedded controllers in the array, the firmware configured to assign at least one power amplifier chassis in the array of power amplifier chassis to function as the master controller power amplifier chassis.

12. The power amplifier chassis of claim 4, wherein the RF power amplifier module further comprises a signal splitter, a first output leg and a second output leg, wherein the RF power amplifier module transmits an amplified RF signal to the signal splitter;

wherein the first output leg is connected to the output port through a waveguide;

and wherein the second output leg is connected to an RF sampling port through an isolation circuit.

13. The power amplifier chassis of claim 5, wherein a first bus bar of the pair of bus bars is connected to a +12VDC external voltage source, and a second bus bar of the pair of bus bars is connected to an external grounded source.

14. The power amplifier chassis of claim 6, wherein the front panel module is adjacent to the front cooling fans, and booster board contains power and control circuitry for operation of the front cooling fans;

the booster board configured to boost a DC bus voltage from 12 volts to 24 volts for powering the front fans.

15. The power amplifier chassis of claim 12, wherein the RF sampling output provides RMS power measurements to a RMS power measurements module.

16. The power amplifier chassis of claim 14, wherein the front panel module contains a LCD display connected to booster board, the LCD display configure to indicate control parameters associated with the front panel module.

17. The power amplifier chassis of claim 16, wherein the LCD display in electrical communication with the booster board for entering data and control commands.