Miniaturized, low power, wireless transmitter and receiver with on-chip antenna, and wireless coupling of on-chip and off-chip antenna

• US 8,412,290 B2
• Filed: 10/16/2009
• Issued: 04/02/2013
• Est. Priority Date: 10/16/2008
• Status: Active Grant

• Current Assignee: King Abdullah University of Science and Technology
• Original Assignee: Atif Shamim, Muhammad Arsalan
• Inventors: Roy, Langis, Shamim, Atif, Arsalan, Muhammad
• Primary Examiner(s): Maung, Nay A
• Assistant Examiner(s): Perez, Angelica
• Application Number:
  US12/580,654
• Publication Number:
  US 20100099367A1
• Time in Patent Office: 1,264 Days
• Field of Search: 455 411- 413, 455/575.7, 455/562.1, 455/550.1, 257/7, 438/67, 343/728
• US Class Current: 455/575.7
• CPC Class Codes: G01T 1/026 Semiconductor dose-rate meters
• CPC Class Codes: H01L 27/14659 Direct radiation imagers structures

Abstract

A miniaturized, low power RF transmitter with a dual mode active on-chip antenna/inductor is disclosed in which antenna also serves as the oscillator inductor. Also disclosed is a miniaturized low power RF receiver with an on-chip antenna; and a RF transmitter system wherein an on-chip antenna is wirelessly coupled to an off chip patch antenna are disclosed. Advantageously, the TX chip is housed in a low loss, e.g. Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna to provide a System-on-Package implementation comprising electromagnetic coupling between a RF TX chip comprising an integrated on-chip antenna and a package antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines, and significantly increases the gain and range of the module with respect to the on-chip antenna alone, without deterioration of the circuit performance and power consumption. Exemplary embodiments are disclosed which may be fabricated using standard CMOS technology, for operation in the 5 GHz U-NII band for applications such as miniaturized, low cost, low power wireless devices and sensor systems.

Claims

1. A Radio Frequency (RF) transmitter system comprising:

a substrate of a multilayer package supporting a monolithically integrated circuit (chip) comprising an RF transmitter comprising an on-chip loop antenna, wherein the loop antenna is placed symmetrically near edges of the chip and active circuitry of the RF transmitter is placed within the loop antenna;

a ground plane overlying the on-chip loop antenna;

a superstrate of the multilayer package carrying a patch antenna overlying the ground plane and spaced therefrom by a gap; and

an aperture defined in the ground plane overlying the chip, with the loop antenna aligned to edges of the aperture, for near field electromagnetic coupling of the on-chip antenna and the patch antenna.

2. An RF transmitter system according to claim 1 wherein the aperture is a slot in the ground plane aligned to the on-chip antenna.

3. An RF transmitter system according to claim 2 wherein the slot length is selected relative to the patch antenna size to reduce backward radiation from the slot in the ground plane.

4. An RF transmitter system according to claim 1 wherein the substrate and superstrate comprise substrate and superstrate layers respectively of a low temperature co-fired ceramic (LTCC) multilayer package.

5. An RF transmitter system according to claim 4 wherein:

the ground plane comprises a common ground plane provided on a top surface of the LTCC substrate overlying the RF transmitter chip, and the aperture comprises a slot in the ground plane aligned with the on-chip antenna;

and wherein the LTCC superstrate carrying the patch antenna is separated from the substrate by spacer means to space the substrate and the superstrate by an air gap.

6. An RF transmitter system according to claim 5 comprising a rechargeable power source carried by the substrate, comprising an ultracapacitor or a lithium polymer cell, interconnected with the RF transmitter chip.

7. An RF transmitter system according to claim 1 operable in the 5GHz U-NII band.

8. An RF transmitter system according to claim 1 further comprising a power source.

9. An RF transmitter system according to claim 1 wherein the RF transmitter comprises a voltage controlled oscillator (VCO) transmitter, and further comprising a data signal source comprising signal processing means coupled to an input of the VCO transmitter.

10. An RF transmitter system according to claim 9 wherein the data signal source comprises a sensor means comprising one or more MOSFET sensors or FGMOSFET sensors.

11. A radio frequency (RF) transmitter comprising:

a monolithically integrated circuit (chip comprising a semiconductor substrate having fabricated thereon an RF oscillator transmitter (TX) circuit comprising an on-chip antenna, wherein the RF oscillator TX circuit comprises a direct feed, open loop voltage controlled oscillator (VCO) TX, wherein a feed line of the oscillator is directly modulated by an input signal;

an off-chip antenna and a common ground plane comprising an aperture aligned to the on-chip antenna and the off-chip antenna; and

the on-chip antenna being configured as a dual mode active antenna wherein;

the on-chip antenna is inductive and acts as VCO tank inductor of the RF oscillator transmitter circuit; and

the on-chip antenna is placed symmetrically on the semiconductor substrate extending close to edges of the semiconductor substrate free from active circuitry and active circuitry of the RF oscillator transmitter circuit is placed within an area defined by the on-chip antenna, to provide a far field radiation pattern for short range transmission and to act as source for near field aperture coupling to the off-chip antenna for extended range transmission.

12. An RF transmitter according to claim 11 wherein the on-chip antenna comprises a loop antenna and active circuitry of the transmitter is placed within the antenna loop, at least part of the antenna loop extending close to edges of the substrate free from active circuitry.

13. An RF transmitter according to claim 12 wherein the loop antenna comprises a rectangular loop and two opposite sides of the loop are placed closed to edges of the substrate free of active circuitry, and input/output pads are located along other sides of the loop.

14. An RF transmitter according to claim 11 wherein the VCO TX comprises an LC cross-coupled differential VCO topology.

15. An RF transmitter according to claim 11 for operation at a frequency in the range of ˜

1GHz to ˜

10GHz.

16. An RF transmitter according to claim 11 for operation at one or more frequencies in the 5.2GHz U-NII band.

17. An RF transmitter according to claim 11 wherein the semiconductor substrate comprises a low resistivity silicon substrate.

18. An RF transmitter according to claim 17 fabricated as CMOS integrated circuit, wherein the on-chip antenna comprises a top metal layer of a CMOS process stack.

19. An RF transmitter according claim 11 fabricated on a substrate area of ˜

1.5 mm² or less.

20. An RF transmitter according to claim 11 wherein the inductor antenna has an inductance of at least 1 nH and/or a differential Q greater than 10.