Package for an implantable neural stimulation device

• US 8,412,339 B2
• Filed: 10/26/2007
• Issued: 04/02/2013
• Est. Priority Date: 08/18/2006
• Status: Active Grant

• Current Assignee: Cortigent Incorporated
• Original Assignee: Second Sight Medical Products, Inc.
• Inventors: Ok, Jerry, Greenberg, Robert J., Talbot, Neil Hamilton, Little, James Singleton, Dai, Rongqing, Neysmith, Jordan Matthew, McClure, Kelly H.
• Primary Examiner(s): Koharski, Christopher D
• Assistant Examiner(s): KIMBALL, JEREMIAH T
• Application Number:
  US11/924,709
• Publication Number:
  US 20080086173A1
• Time in Patent Office: 1,985 Days
• Field of Search: 607/2, 607/54
• US Class Current: 607/54
• CPC Class Codes: A61F 15/001 Packages or dispensers for bandages, cotton balls, drapes, dressings, gauze, gowns, sheets, sponges, swabsticks or towels A61F15/007 takes precedence
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/36046 of the eye
• CPC Class Codes: A61N 1/36125 Details of circuitry or electric components
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37518 Anchoring of the implants, e.g. fixation
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/48225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/06 characterised by the material of the container or its electrical properties
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises

• an electrically non-conductive substrate;
• a plurality of electrically conductive vias through said electrically non-conductive substrate;
• a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack;
• a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and
• a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.

Claims

1. An implantable device, comprising:

a rigid planar substrate having an electrically non-conductive portion;

a plurality of electrically conductive vias through said electrically non-conductive portion, said vias and electrically non-conductive portion forming said rigid substrate;

a flex substrate attached to said rigid substrate, and electrically connected to at least one of said plurality of electrically conductive vias;

a flip-chip demux attached to said flex substrate;

a second circuit attached to said flex substrate, including discrete passives, the flex substrate folded to vertically stack said flip-chip circuit, and said second circuit;

a ring bonded to said planar rigid substrate; and

a cover laser welded to said ring, said ring, said cover and said rigid substrate forming a hermetic package

further comprising a lip between said cover and said ring.

2. The implantable device according to claim 1, wherein said electrically conductive vias are a metallic and ceramic paste co-fired with said electrically non-conductive portion to form a hermetic seal.

3. The implantable device according to claim 1, wherein said ring is brazed to said rigid substrate.

4. The implantable device according to claim 1, further comprising metal traces on said rigid substrate.

5. The implantable device according to claim 4, wherein said metal traces are chosen to withstand braze temperatures.

6. The implantable device according to claim 5, wherein said metal traces comprise one or more of the metals titanium, tantalum, gold, palladium, platinum or layers or alloys thereof.

7. The implantable device according to claim 1 further comprising a flexible circuit bump bonded to said rigid substrate.

8. The implantable device according to claim 1, further comprising metal traces deposited on said rigid substrate and in contact with said electrically conductive vias;

and a flexible circuit attached to said metal traces.

9. The implantable device according to claim 8, wherein said flexible circuit is an electrode array suitable for stimulating tissue.

10. The implantable device according to claim 1, wherein said conductive bumps contain at least one conductive polymer.

11. The implantable device according to claim 1, wherein said conductive bumps contain at least one conductive epoxy or polyimide.

12. The implantable device according to claim 1, wherein said conductive bumps are filled with one or more metals from the group including silver, platinum, iridium, titanium, platinum alloys, iridium alloys, or titanium alloys or mixtures thereof.

13. The implantable device according to claim 12, wherein said metals or metal alloys are in dust, flake or powder form.

14. The implantable device according to claim 1, wherein said implantable device contains two or more integrated circuits.

15. The implantable device according to claim 1, wherein at least one element of said second circuit is wire bonded.

16. The implantable device according to claim 15, wherein said at least one element of said second circuit is wire bonded to said rigid substrate.

17. The implantable device according to claim 1, wherein said second circuit comprises an integrated circuit.

18. The implantable device according to claim 17, wherein said integrated circuit is flip-chip bonded to said flex substrate.

19. The implantable device according to claim 1, wherein said flex substrate is folded over said flip-chip circuit.

20. A method of making an implantable device comprising:

providing a planar ceramic containing non-conductive substrate defining a plurality of vias;

filling said vias with a metal containing ceramic paste;

firing said planar ceramic containing non-conductive substrate forming a rigid substrate;

brazing a metallic ring to said rigid substrate;

bump bonding a flex substrate on a first side to said rigid substrate electrically connecting said flex substrate to said vias;

flip chip bonding a demux circuit to a second side of said flex substrate;

bonding a second circuit to said second side of said flex substrate

bonding a third circuit to said second side of said flex substrate; and

folding said flex substrate to vertically stack said flip-chip circuit, said second circuit and said third circuit;

providing a lip between said ring and said cover;

welding a metallic top to said metallic ring;

wherein at least one of said second circuit and said third circuit includes discrete passives.