Method for bonding a wire conductor laid on a substrate
First Claim
1. A method for bonding a wire conductor arranged on a substrate during the manufacture of a transponder unit having a wire coil and a chip module, comprising:
- in a first phase, permanently joining the coil with the substrate; and
in a second phase, bonding the wire conductor to the chip module, wherein in the first phase at least one of the end portions of the wire conductor intended for later bonding with the chip module is attached to the substrate with a free loop being formed, and that the loop thus formed is gripped in a second phase and a section of the loop is then bonded with a terminal area of the chip module and attached to the terminal area in an electrically conductive manner and wherein in the second phase the loop is gripped by two grippers that take up a section of the loop between them and that are moved in such a manner, relative to the chip module and relative to each other, that said section of the loop finally at least substantially forms a straight line that covers a terminal area of a chip module.
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0 Petitions
Accused Products
Abstract
Method for bonding a wire conductor arranged on a preferably card-like substrate during the manufacture of a transponder unit having a wire coil and a chip module, comprising a first phase, wherein the coil is permanently joined with the substrate, and a second phase, wherein the wire conductor and the chip module are bonded, whereas in the first phase at least one of the end portions of the wire conductor intended for later bonding with the chip module is attached to the substrate with a free loop being formed, and that the loop thus formed is gripped in a second phase and a section of the loop is then bonded with a bonding area of the chip module and attached to it in an electronically conductive manner.
83 Citations
14 Claims
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1. A method for bonding a wire conductor arranged on a substrate during the manufacture of a transponder unit having a wire coil and a chip module, comprising:
- in a first phase, permanently joining the coil with the substrate; and
in a second phase, bonding the wire conductor to the chip module, wherein in the first phase at least one of the end portions of the wire conductor intended for later bonding with the chip module is attached to the substrate with a free loop being formed, and that the loop thus formed is gripped in a second phase and a section of the loop is then bonded with a terminal area of the chip module and attached to the terminal area in an electrically conductive manner and wherein in the second phase the loop is gripped by two grippers that take up a section of the loop between them and that are moved in such a manner, relative to the chip module and relative to each other, that said section of the loop finally at least substantially forms a straight line that covers a terminal area of a chip module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
- in a first phase, permanently joining the coil with the substrate; and
Specification