Microcontact printed thin film capacitors

• US 8,414,962 B2
• Filed: 10/28/2005
• Issued: 04/09/2013
• Est. Priority Date: 10/28/2005
• Status: Expired due to Fees

• Current Assignee: Penn State Research Foundation (Pennsylvania State University)
• Original Assignee: Penn State Research Foundation (Pennsylvania State University)
• Inventors: McKinstry, Susan Trolier, Randall, Clive A., Nagata, Hajime, Beeson, James J., Skamser, Daniel J., Randall, Michael S., Tajuddin, Azizuddin, Pinceloup, Pascal I.
• Primary Examiner(s): Empie, Nathan
• Assistant Examiner(s): ZHAO, XIAO SI
• Application Number:
  US11/262,524
• Publication Number:
  US 20070172592A1
• Time in Patent Office: 2,720 Days
• Field of Search: 427/58, 427/79, 427/97.3, 427/98.4, 101/327, 101/483, 101/492
• US Class Current: 427/79
• CPC Class Codes: H01G 4/1227 based on alkaline earth titanates
• CPC Class Codes: H01G 4/306 made by thin film techniques
• CPC Class Codes: H01G 4/33 Thin- or thick-film capacitors thin- or thick-film circuits H01L27/00; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/40

Abstract

The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO₃ multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO₃ dielectric layers and LaNiO₃ internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.

Claims

1. A method of forming a microcontact printed layer of Ba(Ti_1-xM_x)O₃ where M is a dopant thereof on to a Ni foil substrate comprising,

applying a Ba(Ti_1-xM_x)O₃ precursor solution where 0.005≦

x≦

0.02

where M is any of Mn, Y, Ho, Dy, Er, Mg, Ca, Co or mixtures thereof onto a stamp that has a predetermined pattern thereon to form a coated stamp,

compressing the coated stamp onto a Ni foil substrate to form a pattern of the Ba(Ti_1-xM_x)O₃ precursor solution on the Ni foil substrate,

drying the pattern,

pyrolyzing the pattern and

firing the pattern to produce a micro contact printed layer of Ba(Ti_1-xM_x)O₃ on the Ni foil substrate.

2. The method of claim 1 wherein the Ni foil substrate is any of annealed Ni foil, virgin Ni foil and 99.99% pure Ni foil.

3. The method of claim 2 wherein M is Mn.

4. The method of claim 3 wherein x=0.01.

5. A method of manufacture of a multilayer capacitor by microcontact printing comprising,

applying a precursor solution of an electrode onto a stamp having a predetermined pattern to form a coated stamp,

compressing the coated stamp onto a Ni foil substrate to form a pattern of the precursor solution of the electrode on the substrate,

heat treating the pattern of precursor solution of the electrode to produce a crystallized layer of patterned electrode on the substrate,

applying a precursor solution of a dielectric material onto a stamp having a predetermined pattern to form a dielectric precursor material coated stamp,

compressing the dielectric precursor material coated stamp onto the patterned electrode to form a pattern of the dielectric precursor solution on the patterned electrode,

heat treating the pattern of precursor solution of the dielectric to produce a crystallized layer of patterned dielectric on the patterned electrode,

applying a precursor solution of an electrode onto a tamp having a predetermined pattern to form a coated stamp,

compressing the coated stamp onto the patterned dielectric to form a multilayer monolith comprising a patterned electrode precursor on the dielectric, and

heat treating the monolith to produce a multilayer capacitor.

6. The method of claim 5 wherein the electrode is LaNiO₃ and the dielectric is Ba(Ti_1-xM_x)O₃ where M is any of Mn, Y, Ho, Dy, Er, Mg, Ca, Co, Sr, Zr or mixtures thereof.

7. A method of forming a microcontact printed layer comprising barium titanate on a Ni foil substrate consisting essentially of

applying a barium titanate precursor solution onto a stamp that has a predetermined pattern thereon to form a coated stamp,

compressing the coated stamp onto a Ni foil substrate to form a pattern of the precursor solution on the Ni foil substrate,

drying the pattern,

pyrolyzing the pattern and

firing the pattern to produce a micro contact printed layer of stoichiometric barium titanate on the Ni foil substrate.

8. A method of manufacture of a multilayer capacitor by microcontact printing consisting essentially of

applying a precursor solution of an electrode onto a stamp having a predetermined pattern to form a coated stamp,

compressing the coated stamp onto a Ni foil substrate to form a pattern of the precursor solution of the electrode on the substrate,

heat treating the pattern of precursor solution of the electrode to produce a crystallized layer of patterned electrode on the substrate,

applying a precursor solution of a dielectric material onto a stamp having a predetermined pattern to form a dielectric precursor material coated stamp,

compressing the dielectric precursor material coated stamp onto the patterned electrode to form, a pattern of the dielectric precursor solution on the patterned electrode,

heat treating the pattern of precursor solution of the dielectric to produce a crystallized layer of patterned dielectric on the patterned electrode,

applying a precursor solution of an electrode onto a stamp having a predetermined pattern to form a coated micro stamp,

compressing the coated stamp onto the patterned dielectric to form a multilayer monolith comprising a patterned electrode precursor on the dielectric, and

heat treating the monolith to produce a multilayer capacitor.